@inproceedings{Mohammed:2015:10.1063/1.4906675,
author = {Mohammed, IK and Charalambides, MN and Williams, JG and Rasburn, J},
doi = {10.1063/1.4906675},
pages = {289--292},
publisher = {AMER INST PHYSICS},
title = {Modelling Deformation and Fracture in Confectionery Wafers},
url = {http://dx.doi.org/10.1063/1.4906675},
year = {2015}
}

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TY  - CPAPER
AB  - The aim of this research is to model the deformation and fracture behaviour of brittle wafers often used in chocolate confectionary products. Three point bending and compression experiments were performed on beam and circular disc samples respectively to determine the 'apparent' stress-strain curves in bending and compression. The deformation of the wafer for both these testing types was observed in-situ within an SEM. The wafer is modeled analytically and numerically as a composite material with a core which is more porous than the skins. X-ray tomography was used to generate a three dimensional volume of the wafer microstructure which was then meshed and used for quantitative analysis. A linear elastic material model, with a damage function and element deletion, was used and the XMT generated architecture was loaded in compression. The output from the FE simulations correlates closely to the load-deflection deformation observed experimentally.
AU  - Mohammed,IK
AU  - Charalambides,MN
AU  - Williams,JG
AU  - Rasburn,J
DO  - 10.1063/1.4906675
EP  - 292
PB  - AMER INST PHYSICS
PY  - 2015///
SN  - 0094-243X
SP  - 289
TI  - Modelling Deformation and Fracture in Confectionery Wafers
UR  - http://dx.doi.org/10.1063/1.4906675
UR  - http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000354845400048&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202
UR  - http://hdl.handle.net/10044/1/25617
ER  - 

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