2017 CANDO Implant Reliability Test Chip (CBIT17F02_CANDO)
Test chip to validate a number of prototype circuits for bioinstrumentation applications. These include: (1) Chemical Imaging This integrated circuit includes two portions: (1) test structures for long-term reliability testing of coated CMOS substrate implantable packaging; and (2) Continuous-time Analogue-to-Digital Converter (CT-ADC) design.
- Related project: CANDO
Technology: AMS 0.35μm 2P4M CMOS (C35B4C3)
Silicon Area: 2mm × 3.5mm
Designers: Federico Mazza, Yan Liu, Timothy G. Constandinou
Tape-out: June 2017