Publications
217 results found
Hong G, Holmes AS, 2002, Laser machining of 3D parts for microturbines, 3rd international symposium on laser precision microfabrication (LPM2002), Singapore, 27 - 29 May 2002
Holmes AS, 2002, Laser processes for MEMS manufacture, Riken Review, Vol: 43, Pages: 63-69, ISSN: 0919-3405
Wang CH, Holmes AS, Gao S, 2001, Laser-assisted bumping for flip chip assembly, EMAP 00 conference, Publisher: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, Pages: 109-114, ISSN: 1521-334X
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- Citations: 31
Luttge R, Holmes AS, Schlautmann S, et al., 2001, Microoptical scan device, MME2001, Cork, Ireland, 16 - 18 September 2001
Holmes AS, Wang C, Gao S, 2001, Lead-free flip chip technology based on copper columns, 3rd international workshop on radiation imaging detectors
Quentel F, Fieret J, Holmes AS, et al., 2001, Multilevel diffractive optical element manufacture by excimer laser ablation and halftone masks, Bellingham, Conference on laser applications in microelectronic and optoelectronic manufacturing VI, San Jose, California, 22 - 24 January 2001, Publisher: Spie-Int Society Optical Engineering, Pages: 420-431
Holmes AS, 2001, Laser fabrication and assembly processes for MEMS, Bellingham, Conference on laser applications in microelectronic and optoelectronic manufacturing VI, San Jose, California, 22 - 24 January 2001, Publisher: Spie-Int Society Optical Engineering, Pages: 297-306
Hutt DA, Rhodes DG, Conway PP, et al., 2000, Investigation of a Solder Bumping Technique for Flip-Chip Interconnection, Soldering and Surface Mount Technologies
Holmes AS, 2000, Microengineering - The Next Revolution, IFHTSE Congress, 29 Oct - 1 Nov 2000, Melbourne, Australia
Mcnie M, King D, Vizard C, et al., 2000, High Aspect Ratio Micromachining (HARM) Technologies for Microinertial Devices, Microsystem Technologies, Vol: 6, Pages: 184-188
Mihailov SJ, Bilodeau F, Hill KO, et al., 2000, Apodization Technique for Fibre Grating Fabrication with a Halftone Transmission Amplitude Mask, Applied Optics, Vol: 39, Pages: 3670-3677
Holmes AS, Lee KW, 2000, Multi-layer Electroformed Devices on Silicon Substrates, IEE Colloquium on Demonstrated Micromachining Techniques for Industry, Birmingham, 29 March, 2000
Holmes AS, Saidam SM, 2000, Laser-assisted Assembly for Hybrid MEMS, ICALEO 2000, 2-5 October 2000, Michigan, USA
Wang CH, Holmes AS, 2000, Laser-assisted Bump Transfer for Flip Chip Assembly, International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), Hong Kong
Paterson C, Holmes AS, Smith RW, 1999, Excimer laser ablation of microstructures: A numerical model, JOURNAL OF APPLIED PHYSICS, Vol: 86, Pages: 6538-6546, ISSN: 0021-8979
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- Citations: 39
Roberts DA, Syms PRA, Holmes AS, et al., 1999, Dual numerical aperture confocal operation of moving fibre bar code reader, ELECTRONICS LETTERS, Vol: 35, Pages: 1656-1658, ISSN: 0013-5194
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- Citations: 9
Lee KW, Holmes AS, 1999, Electrostatic Actuation in Electroformed Ni Microstructures, IEE Colloquium, Microengineering, modelling and design, London, 4 March 1999
Wang CH, Holmes AS, Hutt DA, et al., 1999, Laser Assisted Bump Transfer for Area Array Flip Chip Assembly, IEEE - CPMT Workshop on Flip Chip and Ball Grid Arrays, Berlin
Hutt DA, Rhodes DG, Conway PP, et al., 1999, Investigation of a Low Cost Solder Bumping Technique for Flip-cip Interconnection, 24th International Electronics Manufacturing Technology Symposium, Austin, Texas, 18-19 October 1999
Roberts DA, Syms RRA, Holmes AS, et al., 1999, Dual numerical aperture confocal operation of a moving fibre bar-code reader, Electronics Letters, Vol: 35, Pages: 1656-1657
Holmes AS, Paterson C, 1998, Excimer Laser Micromachining for Microsystems, Digest of Make it with lasers Workshop held 19 November 1998
Syms RRA, Holmes AS, Huang W, et al., 1998, Development of the SC-RTA process for the fabrication of sol-gel based silica-on-silicon integrated optic components, Journal of Sol-Gel Science and Technology
Holmes AS, Saidam SM, 1998, Sacrificial Layer Process with Laser-Driven Release for Batch Assembly Operations, IEE Microelectromechanical Systems, Vol: 7, Pages: 416-422
Holmes AS, 1997, Excimer Lasers in Microsystems Technology, Digest of Make it with Lasers Workshop held 27 November 1997
Holmes AS, Saidam SM, Lawes RA, 1997, Low Cost Liga Processes, IEE Colloquium Digest Microengineering Technologies and How to Exploit Them, 1997, Pages: 1-4
Zhu J, Holmes AS, Arnold J, et al., 1996, Laminated Dry Film Resists for Microengineering Applications, Microelectronic Engineering, Vol: 30, Pages: 365-368
Lawes RA, Holmes AS, Goodall FN, 1996, The Formation of Moulds for 3D Microstructures using Excimer Laser Ablation, Microsystem Technologies, Vol: 3, Pages: 17-19
SYMS RRA, SCHNEIDER V, HUANG W, et al., 1995, LOW-LOSS ACHIEVED IN SOL-GEL BASED SILICA-ON-SILICON INTEGRATED-OPTICS USING BOROPHOSPHOSILICATE GLASS, ELECTRONICS LETTERS, Vol: 31, Pages: 1833-1834, ISSN: 0013-5194
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- Citations: 21
SYMS RRA, HOLMES AS, 1994, DEPOSITION OF THICK SILICA TITANIA SOL-GEL FILMS ON SI SUBSTRATES, JOURNAL OF NON-CRYSTALLINE SOLIDS, Vol: 170, Pages: 223-233, ISSN: 0022-3093
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- Citations: 52
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