Christopher Gourlay is a Reader in Solidification Processing. He read metallurgy at the University of Oxford (MEng, 2002) and the University of Queensland (PhD, 2007), where he worked within the Australian Cooperative Research Centre for Cast Metals Manufacturing. He was then a Postdoctoral Research Fellow in the Australian Research Council's Centre of Excellence for design in light metals (2007-08). He joined the Materials Department at Imperial College in 2008 on a RAEng/EPSRC Research Fellowship and was made Lecturer in 2012, Senior Lecturer in 2014 and Reader in 2016. From 2014-19, Chris holds an EPSRC ‘Research Fellowship for Growth’ in solidification processing of alloys for sustainable manufacturing and is a member of the Engineering Alloys research theme in the Department.
Research focuses on alloy solidification and its application in electronic soldering and casting with interests including: Mushy-zone mechanics; X-ray imaging of solidification phenomena; Nucleation; Eutectics; Intermetallic crystal growth; Pb-free soldering; and High-pressure die casting.
Selected publications are given below. A full list of research publications can be found at the tab above, or on Google Scholar. Patents can be found at Google patents. EPSRC research grants can be found at Grants on the web.
et al., 2017, Grain refinement of electronic solders: The potential of combining solute with nucleant particles, Journal of Alloys and Compounds, Vol:715, ISSN:0925-8388, Pages:471-485
et al., 2017, Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints, Journal of Alloys and Compounds, Vol:701, ISSN:0925-8388, Pages:321-334
Ma ZL, Gourlay CM, 2017, Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates, Journal of Alloys and Compounds, Vol:706, ISSN:0925-8388, Pages:596-608
et al., 2017, Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections, Acta Materialia, Vol:126, ISSN:1359-6454, Pages:540-551
et al., 2017, Dilatancy in semi-solid steels at high solid fraction, Acta Materialia, Vol:125, ISSN:1359-6454, Pages:187-195
et al., 2017, Nucleation of tin on the Cu6Sn5 layer in electronic interconnections, Acta Materialia, Vol:123, ISSN:1359-6454, Pages:404-415