BibTex format
@article{Gu:2019:10.1007/s11664-018-6744-1,
author = {Gu, T and Gourlay, C and Britton, T},
doi = {10.1007/s11664-018-6744-1},
journal = {Journal of Electronic Materials},
pages = {107--121},
title = {Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5Cu solder},
url = {http://dx.doi.org/10.1007/s11664-018-6744-1},
volume = {48},
year = {2019}
}