Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Belyakov:2019:10.1007/s10854-018-0302-8,
author = {Belyakov, S and Xian, J and Zeng, G and Sweatman, K and Nishimura, T and Akaiwa, T and Gourlay, C},
doi = {10.1007/s10854-018-0302-8},
journal = {Journal of Materials Science: Materials in Electronics},
pages = {378--390},
title = {Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints},
url = {http://dx.doi.org/10.1007/s10854-018-0302-8},
volume = {30},
year = {2019}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - In recent years there has been increased interest in Bi-containing solders to improve the reliability of electronics and drive down processing temperatures. When the Bi content is more than ~ 2 wt% in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solders, (Bi) phase forms by a non-equilibrium eutectic reaction and also precipitates in the solid state. Here, we study the development of bismuth plates during room temperature storage in a range of Bi-containing solders. It is shown that Bi plates precipitate with one of two (Bi)–βSn orientation relationships (ORs). During coarsening the OR with the better lattice match grows at the expense of the other, leading to a single OR. The plate coarsening kinetics scale with the cube root of holding time and are relatively rapid, with plates exceeding 1 µm in length within 1 day at room temperature. Prolonged room temperature storage of more than 1 year resulted in Bi accumulation in 5–20 µm (Bi) particles at βSn grain boundaries.
AU  - Belyakov,S
AU  - Xian,J
AU  - Zeng,G
AU  - Sweatman,K
AU  - Nishimura,T
AU  - Akaiwa,T
AU  - Gourlay,C
DO  - 10.1007/s10854-018-0302-8
EP  - 390
PY  - 2019///
SN  - 0957-4522
SP  - 378
TI  - Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints
T2  - Journal of Materials Science: Materials in Electronics
UR  - http://dx.doi.org/10.1007/s10854-018-0302-8
UR  - http://hdl.handle.net/10044/1/65815
VL  - 30
ER  -
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