Imperial College London
Portrait Picture

ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Gu:2020:10.1016/j.actamat.2020.06.013,
author = {Gu, T and Tong, V and Gourlay, C and Britton, T},
doi = {10.1016/j.actamat.2020.06.013},
journal = {Acta Materialia},
pages = {31--43},
title = {In-situ study of creep in Sn-3Ag-0.5Cu solder},
url = {http://dx.doi.org/10.1016/j.actamat.2020.06.013},
volume = {196},
year = {2020}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt% sample with a columnar microstructure have been investigated through in-situ creep testing under constant stress of 30 MPa at ~298 K. This is important, as 298 K is high temperature within the solder system and in-situ observations of microstructure evolution confirm the mechanisms involved in deformation and ultimately failure of the material. The sample has been observed in-situ using repeat and automatic forescatter diode and auto electron backscatter diffraction imaging. During deformation, polygonisation and recrystallisation are observed heterogeneously with increasing strain, and these correlate with local lattice rotations near matrix-intermetallic compound interfaces. Recrystallised grains have either twin or special boundary relationships to their parent grains. The combination of these two imaging methods reveal grain 1 (loading direction, LD, 10.4° from [100]) deforms less than the neighbour grain 2 (LD 18.8° from [110]), with slip traces in the strain localised regions. In grain 2, (10)[001] slip system is observed and in grain 1 (10)[1]/2 and (110)[11]/2 slip systems are observed. Lattice orientation gradients build up with increasing plastic strain and near fracture recrystallisation is observed concurrent with fracture.
AU  - Gu,T
AU  - Tong,V
AU  - Gourlay,C
AU  - Britton,T
DO  - 10.1016/j.actamat.2020.06.013
EP  - 43
PY  - 2020///
SN  - 1359-6454
SP  - 31
TI  - In-situ study of creep in Sn-3Ag-0.5Cu solder
T2  - Acta Materialia
UR  - http://dx.doi.org/10.1016/j.actamat.2020.06.013
UR  - https://www.sciencedirect.com/science/article/pii/S1359645420304377?via%3Dihub
UR  - http://hdl.handle.net/10044/1/80888
VL  - 196
ER  -
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