Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@misc{Nishimura:2019,
author = {Nishimura, T and Sweatman, K and Nishimura, T and Gourlay, C and Ma, Z and Belyakov, S},
title = {Solder joint and bonding method},
type = {Patent},
url = {https://patents.google.com/patent/WO2019009427A1/en?oq=WO2019009427A1},
year = {2019}
}
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RIS format (EndNote, RefMan)

TY  - PAT
AB  - Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least two copper substrates (2) are bonded to each other using a lead-free solder alloy including Sn. A solder ball (1) relating to the lead-free solder alloy comprises: one or a plurality of nucleation grains (4); and a single grain βSn of which a [001] direction is parallel with a facet plane of the nucleation grains (4), and which is crystal-oriented in a specific direction with respect to the copper substrates (2).
AU  - Nishimura,T
AU  - Sweatman,K
AU  - Nishimura,T
AU  - Gourlay,C
AU  - Ma,Z
AU  - Belyakov,S
PY  - 2019///
TI  - Solder joint and bonding method
UR  - https://patents.google.com/patent/WO2019009427A1/en?oq=WO2019009427A1
ER  -
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