Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Belyakov:2021:10.1007/s11664-020-08507-x,
author = {Belyakov, SA and Coyle, RJ and Arfaei, B and Xian, JW and Gourlay, CM},
doi = {10.1007/s11664-020-08507-x},
journal = {Journal of Electronic Materials},
pages = {825--841},
title = {Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony},
url = {http://dx.doi.org/10.1007/s11664-020-08507-x},
volume = {50},
year = {2021}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate microstructure evolution and failure in harsh accelerated thermal cycling (ATC) of a Sn-3.8Ag-0.9Cu solder with 5.5 wt.% antimony as the major addition in two ball grid array (BGA) packages. SbSn particles are shown to precipitate on both Cu6Sn5 and as cuboids in β-Sn, with reproducible orientation relationships and a good lattice match. Similar to Sn-Ag-Cu solders, the microstructure and damage evolution were generally localised in the β-Sn near the component side where localised β-Sn misorientations and subgrains, accelerated SbSn and Ag3Sn particle coarsening, and β-Sn recrystallisation occurred. Cracks grew along the network of recrystallised grain boundaries to failure. The improved ATC performance is mostly attributed to SbSn solid-state precipitation within β-Sn dendrites, which supplements the Ag3Sn that formed in a eutectic reaction between β-Sn dendrites, providing populations of strengthening particles in both the dendritic and eutectic β-Sn.
AU  - Belyakov,SA
AU  - Coyle,RJ
AU  - Arfaei,B
AU  - Xian,JW
AU  - Gourlay,CM
DO  - 10.1007/s11664-020-08507-x
EP  - 841
PY  - 2021///
SN  - 0361-5235
SP  - 825
TI  - Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony
T2  - Journal of Electronic Materials
UR  - http://dx.doi.org/10.1007/s11664-020-08507-x
UR  - https://link.springer.com/article/10.1007%2Fs11664-020-08507-x
UR  - http://hdl.handle.net/10044/1/84154
VL  - 50
ER  -
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