Ph.D., Engineering Sciences, Harvard University, 2003
S.M., Applied Mathematics, Harvard University, 2001
B.S., Engineering Mechanics, Michigan State University, 1998
Prior to joining the faculty in 2006, Dr. Balint was a research associate in the Cambridge Centre for Micromechanics, Cambridge University (2003-2005), where he worked on modelling size effects in polycrystalline materials using planar discrete dislocation plasticity. Dr Balint has also worked as an engineer at Exponent, Inc. investigating civil disasters resulting from fatigue and overload fracture in metal structures, and studied the mechanical response of knee, hip and spinal implants in the human body using computational modeling.
Dr. Balint has expertise particularly in the micromechanics of crystalline materials, dislocation and defect modelling, multilayer thin film evolution, fracture and failure (e.g. thermal barrier coatings), and in developing novel metal forming methods. His training was in theoretical solid mechanics, with emphasis on thin films and fracture mechanics.
et al., 2017, A Dynamic Discrete Dislocation Plasticity study of elastodynamic shielding of stationary cracks, Journal of the Mechanics and Physics of Solids, Vol:98, ISSN:0022-5096, Pages:1-11
et al., 2017, The effect of temperature on the elastic precursor decay in shock loaded FCC aluminium and BCC iron, International Journal of Plasticity, Vol:96, ISSN:0749-6419, Pages:135-155
Junyi L, Balint DS, 2017, Optimal shunt parameters for maximising wave attenuation with periodic piezoelectric patches, Journal of Intelligent Material Systems and Structures, Vol:28, ISSN:1045-389X, Pages:108-123
et al., 2017, Test-piece design for experimental and numerical evaluation of damage in relation to spatial triaxial stress inversion, International Journal of Damage Mechanics, Vol:26, ISSN:1056-7895, Pages:588-607
et al., An Investigation, Using Standard Experimental Techniques, to Determine FLCs at Elevated Temperature for Aluminium Alloys, The 3rd International Conference on New Forming Technology