Imperial College London
Dr Michail Kiziroglou

DrMichailKiziroglou

Faculty of Engineering, Department of Electrical and Electronic Engineering

Research Fellow
 
 
 
//

Contact

 

+44 (0)20 7594 6216m.kiziroglou

 
 
//

Location

 

706Electrical EngineeringSouth Kensington Campus

//

Summary

 

Publications

Citation

BibTex format

@article{Kiziroglou:2015:10.1007/s11664-015-3987-y,
author = {Kiziroglou, ME and Yeatman, EM},
doi = {10.1007/s11664-015-3987-y},
journal = {Journal of Electronic Materials},
pages = {4589--4594},
title = {Protection of Electronics from Environmental Temperature Spikes by Phase Change Materials},
url = {http://dx.doi.org/10.1007/s11664-015-3987-y},
volume = {44},
year = {2015}
}
Download

RIS format (EndNote, RefMan)

TY  - JOUR
AB  - Protection of electronics from high-temperature environments is desirable inapplications such as harsh-environment industrial sensor networks for continuousmonitoring and probing. In this paper, the use of phase changematerial (PCM) encapsulation of electronics is proposed as protection fromenvironment-induced, probing-induced or electronic power burst-inducedtemperature spikes. An outline of the encapsulation method is given and aheat flow analysis is performed. A lumped element model is introduced and anumerical simulator is implemented. An encapsulation setup is fabricated andtested, allowing an experimental validation of the proposed method andmodel. The numerical simulation model is then used to study particulartemperature spike scenarios. The results demonstrate that at reasonableencapsulation sizes and for commercially available phase change and insulationmaterials, short-term protection from large temperature spikes can beprovided by the proposed method. As an indicative example, for a typicalsensor node normally operating at a 20C environment, PCM encapsulationmay provide protection for 28 s of exposure to 1000C per PCM gram.
AU  - Kiziroglou,ME
AU  - Yeatman,EM
DO  - 10.1007/s11664-015-3987-y
EP  - 4594
PY  - 2015///
SN  - 0361-5235
SP  - 4589
TI  - Protection of Electronics from Environmental Temperature Spikes by Phase Change Materials
T2  - Journal of Electronic Materials
UR  - http://dx.doi.org/10.1007/s11664-015-3987-y
UR  - http://hdl.handle.net/10044/1/26877
VL  - 44
ER  -
Download