BibTex format
@inproceedings{Rajaguru:2017,
author = {Rajaguru, P and Bailey, C and Lu, H and Aliyu, AM and Castellazzi, A and Pathirana, V and Udugampola, N and Trajkovic, T and Udrea, F and Mitcheson, PD and Elliott, ADT},
publisher = {IEEE},
title = {Co-Design/Simulation of Flip-Chip Assembly for High Voltage IGBT Packages},
url = {https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000463488300064&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb},
year = {2017}
}