Imperial College London


Faculty of EngineeringDepartment of Electrical and Electronic Engineering

Research Postgraduate



peilong.feng14 Website




B422Bessemer BuildingSouth Kensington Campus





Peilong Feng received the B.E. degree in electrical engineering from the Henan Polytechnic University, China, in 2011, the M.S. degree in microelectronic systems design from University of Southampton, UK, in 2012, and the M.S. degree in analogue and digital integrated circuit design from Imperial College London, UK, in 2015. He is currently pursuing the PhD degree in the Next Generation Neural Interfaces Lab at the Imperial College London. From 2012 to 2014, he worked as an electronic engineer in Shanghai Research Institute, China Coal Technology and Engineering group. He was the co-recipient of the Biomedical Circuits and Systems Conference (BioCAS) Best Paper Award in 2017.

Selected Publications

Journal Articles

Feng P, Yeon P, Cheng Y, et al., 2018, Chip-scale coils for millimeter-sized bio-implants, IEEE Transactions on Biomedical Circuits and Systems, Vol:12, ISSN:1932-4545, Pages:1088-1099


Ahmadi N, Cavuto ML, Feng P, et al., 2019, Towards a distributed, chronically-implantable neural interface, 9th IEEE/EMBS International Conference on Neural Engineering (NER), IEEE, Pages:719-724, ISSN:1948-3546

Feng P, Constandinou TG, 2018, Robust wireless power transfer to multiple mm-scale freely-positioned Neural implants, IEEE Biomedical Circuits and Systems (BioCAS) Conference 2018, IEEE, Pages:363-366

Leene L, Maslik M, Feng P, et al., 2018, Autonomous SoC for neural local field potential recording in mm-scale wireless implants, IEEE International Symposium on Circuits and Systems, IEEE, Pages:1-5, ISSN:2379-447X

Szostak K, Mazza F, Maslik M, et al., 2017, Microwire-CMOS Integration of mm-Scale Neural Probes for Chronic Local Field Potential Recording, IEEE Biomedical Circuits and Systems (BioCAS) Conference, IEEE, Pages:492-495

Feng P, Constandinou TG, Yeon P, et al., 2017, Millimeter-Scale Integrated and Wirewound Coils for Powering Implantable Neural Microsystems, IEEE Biomedical Circuits and Systems (BioCAS) Conference, Pages:488-491

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