Peilong Feng received the B.E. degree in electrical engineering from the Henan Polytechnic University, China, in 2011, the M.S. degree in microelectronic systems design from University of Southampton, UK, in 2012, and the M.S. degree in analogue and digital integrated circuit design from Imperial College London, UK, in 2015. He is currently pursuing the PhD degree in the Next Generation Neural Interfaces Lab at the Imperial College London. From 2012 to 2014, he worked as an electronic engineer in Shanghai Research Institute, China Coal Technology and Engineering group. He was the co-recipient of the Biomedical Circuits and Systems Conference (BioCAS) Best Paper Award in 2017.
et al., 2018, Chip-scale coils for millimeter-sized bio-implants, IEEE Transactions on Biomedical Circuits and Systems, Vol:12, ISSN:1932-4545, Pages:1088-1099
et al., 2019, Towards a distributed, chronically-implantable neural interface, 9th IEEE/EMBS International Conference on Neural Engineering (NER), IEEE, Pages:719-724, ISSN:1948-3546
Feng P, Constandinou TG, 2018, Robust wireless power transfer to multiple mm-scale freely-positioned Neural implants, IEEE Biomedical Circuits and Systems (BioCAS) Conference 2018, IEEE, Pages:363-366
et al., 2018, Autonomous SoC for neural local field potential recording in mm-scale wireless implants, IEEE International Symposium on Circuits and Systems, IEEE, Pages:1-5, ISSN:2379-447X
et al., 2017, Microwire-CMOS Integration of mm-Scale Neural Probes for Chronic Local Field Potential Recording, IEEE Biomedical Circuits and Systems (BioCAS) Conference, IEEE, Pages:492-495
et al., 2017, Millimeter-Scale Integrated and Wirewound Coils for Powering Implantable Neural Microsystems, IEEE Biomedical Circuits and Systems (BioCAS) Conference, Pages:488-491