BibTex format

author = {Yao, C and Leahu, G and Holicky, M and Liu, S and Fenech-Salerno, B and Lai, MC and Larciprete, MC and Ducati, C and Divitini, G and Li, Voti R and Sibilia, C and Torrisi, F},
journal = {Advanced Functional Materials},
title = {Thermally conductive hexagonal boron nitride/polymer composites for efficient heat transport},
url = {},
year = {2024}

RIS format (EndNote, RefMan)

AB - Commercial thermally conductive dielectric materials used in electronic packagingtypically exhibit thermal conductivities ranging from κ ~ 0.8 to κ ~ 4.2 W m−1 K−1.Hexagonal boron nitride (h-BN) flakes are promising thermally conductive materials forthermal management of next-generation electronics. We demonstrate a cellulosebasedcomposite embedded with few-layer h-BN flakes, achieving a κ ~ 21.7 W m−1K−1, prepared using a cost-effective and scalable processing procedure. This value ismore than 5 times higher than the thermal conductivity observed in compositesembedded with bulk h-BN (κ ~ 4.5 W m−1 K−1), indicating the benefits of the superiorthermal conductivity of few-layer h-BN on the thermal conductivity of h-BN polymercomposites. When applied as a paste for thermal interface material, the few-layer h-BNcomposite can reduce the maximum temperature of a heating pad at a power densityof h = 2.48 W cm−2 by ΔTmax ~ 24.5 °C compard to bulk h-BN composites at thesame h-BN loading. Our results provide an effective approach to improve the thermalconductivity value of cellulose-based thermal pastes for thermal interface materials anddemonstrated their viability for the heat dissipation in integrated circuits and highpowerelectronic devices.
AU - Yao,C
AU - Leahu,G
AU - Holicky,M
AU - Liu,S
AU - Fenech-Salerno,B
AU - Lai,MC
AU - Larciprete,MC
AU - Ducati,C
AU - Divitini,G
AU - Li,Voti R
AU - Sibilia,C
AU - Torrisi,F
PY - 2024///
SN - 1616-301X
TI - Thermally conductive hexagonal boron nitride/polymer composites for efficient heat transport
T2 - Advanced Functional Materials
UR -
ER -