Citation

BibTex format

@inproceedings{Feng:2018,
author = {Feng, P and Constandinou, TG},
pages = {363--366},
publisher = {IEEE},
title = {Robust wireless power transfer to multiple mm-scale freely-positioned Neural implants},
url = {http://hdl.handle.net/10044/1/63459},
year = {2018}
}

RIS format (EndNote, RefMan)

TY  - CPAPER
AB - This paper presents a novel wireless power transfer(WPT) scheme that consists of a two-tier hierarchy of near-field inductively coupled links to provide efficient power transferefficiency (PTE) and uniform energy distribution for mm-scalefree-positioned neural implants. The top tier facilitates a tran-scutaneous link from a scalp-worn (cm-scale) primary coil toa subcutaneous array of smaller, parallel-connected secondarycoils. These are then wired through the skull to a correspondingset of parallel connected primary coils in the lower tier, placedepidurally. These then inductively couple to freely positioned(mm-scale) secondary coils within each subdural implant. Thisarchitecture has three key advantages: (1) the opportunity toachieve efficient energy transfer by utilising two short-distanceinductive links; (2) good uniformity of the transdural powerdistribution through the multiple (redundant) coils; and (3) areduced risk of infection by maintaining the dura protecting theblood-brain barrier. The functionality of this approach has beenverified and optimized through HFSS simulations, to demonstratethe robustness against positional and angular misalignment. Theaverage 11.9% PTE and 26.6% power distribution deviation(PDD) for horizontally positioned Rx coil and average 2.6% PTEand 62.8% power distribution deviation for the vertical Rx coilhave been achieved.
AU - Feng,P
AU - Constandinou,TG
EP - 366
PB - IEEE
PY - 2018///
SP - 363
TI - Robust wireless power transfer to multiple mm-scale freely-positioned Neural implants
UR - http://hdl.handle.net/10044/1/63459
ER -