Imperial College London
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ProfessorAndrewHolmes

Faculty of Engineering, Department of Electrical and Electronic Engineering

Professor of Microelectromechanical Systems
 
 
 
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Contact

 

+44 (0)20 7594 6239a.holmes Website

 
 
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Assistant

 

Ms Susan Brace +44 (0)20 7594 6215

 
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Location

 

701Electrical EngineeringSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@inproceedings{Pusch:2015,
author = {Pusch, TP and D'Auria, M and Tolou, N and Holmes, AS},
publisher = {AMER SOC MECHANICAL ENGINEERS},
title = {LASER MICROMACHINING OF THIN BEAMS FOR SILICON MEMS: OPTIMIZATION OF CUTTING PARAMETERS USING THE TAGUCHI METHOD},
year = {2015}
}
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RIS format (EndNote, RefMan)

TY  - CPAPER
AB  - While thin beams are widely used structural elements inMicro-Electro-Mechanical-Systems (MEMS) there are very fewstudies investigating the laser machining of clean high aspectratio silicon beams. This work presents a systematic study ofselected influencing cutting parameters with the goal of machininghigh aspect ratio beams with low side wall surface roughness(Ra) and high cross section verticality, i.e. low taper angle.The Taguchi method was used to find the optimal settingfor each of the selected parameters (pulse frequency, laser diodecurrent, pulse overlap, number of patterns to be marked, gapsize between patterns) utilizing orthogonal arrays and signalto-noise(S/N) ratio analysis. Double-sided clamped beams of100µm width and 10mm length were machined in silicon wafersof 525µm thickness using a nanosecond solid-state UV laser system(355nm wavelength). Our experimental results show thatbeams with an aspect ratio as high as 17.5 can be manufactured.Furthermore, a surface roughness of Ra = 0.37µm and taper angleof α = 2.52 degrees can be achieved. This will make the fastfabrication of MEMS devices with aspect ratios as high as thosefrom deep reactive ion etching possible.
AU  - Pusch,TP
AU  - D'Auria,M
AU  - Tolou,N
AU  - Holmes,AS
PB  - AMER SOC MECHANICAL ENGINEERS
PY  - 2015///
TI  - LASER MICROMACHINING OF THIN BEAMS FOR SILICON MEMS: OPTIMIZATION OF CUTTING PARAMETERS USING THE TAGUCHI METHOD
ER  -
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