Imperial College London


Faculty of EngineeringDepartment of Electrical and Electronic Engineering

Research Associate in Integrated Circuit Design



a.mifsud Website




Electrical EngineeringSouth Kensington Campus





Andrea received his B.Eng. in Electrical and Electronic Engineering in 2016 at the University of Malta, with a particular focus on embedded systems. He furthered his studies with an MSc in Analogue and Digital Integrated Circuit Design at Imperial College London, developing a data and power delivery system for wired implantable devices, as part of his thesis titled “Wired Full-Duplex Communication and Power Delivery for Medical Implantable Systems”. Andrea then joined Science and Technology Facilities Council (STFC) as a CMOS Sensor Design Engineer within the CMOS Sensor Design group. His work focused on the design and testing of CMOS image sensors including both pixel and periphery circuit design.

As of August 2020, he joined the Next Generation Neural Interfaces (NGNI) lab and the Centre for Bio-Inspired Technology (CBIT) at Imperial College London as a Research Associate and PhD candidate in IC design.

Andrea's current work focuses on mixed-signal systems and circuits, and scalable architectures such as imagers and mass characterisation of devices and technologies (for e.g. ReRAM).

Selected Publications


Xie L, Shen J, Mifsud A, et al., 2022, A wide dynamic range read-out system for resistive switching technology, 2022 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, Pages:2003-2007

Mifsud A, Shen J, Feng P, et al., 2022, A CMOS-based characterisation platform for emerging RRAM technologies, 2022 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, Pages:75-79

Shen J, Mifsud A, Xie L, et al., 2022, A high-voltage characterisation platform for emerging resistive switching technologies, 2022 IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, Pages:3537-3541

Mifsud A, Haci D, Ghoreishizadeh S, et al., 2017, Adaptive Power Regulation and Data Delivery for Multi-Module Implants, IEEE Biomedical Circuits and Systems (BioCAS) Conference, IEEE, Pages:584-587

More Publications