Imperial College London
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Dr T Ben Britton

Faculty of Engineering, Department of Materials

Visiting Reader
 
 
 
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Contact

 

+44 (0)20 7594 2634b.britton Website

 
 
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Location

 

B301Bessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Gu:2020:10.1016/j.scriptamat.2019.09.003,
author = {Gu, T and Xu, Y and Gourlay, CM and Britton, TB},
doi = {10.1016/j.scriptamat.2019.09.003},
journal = {Scripta Materialia},
pages = {55--60},
title = {In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint},
url = {http://dx.doi.org/10.1016/j.scriptamat.2019.09.003},
volume = {175},
year = {2020}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - The heterogeneous evolution of microstructure in a single grain Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation within the joint, localised towards the corners. This deformation is induced by the constraint and the coefficient of thermal expansion (CTE) mismatch between the β-Sn, Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (110)[11]/2 and (0)[111]/2.
AU  - Gu,T
AU  - Xu,Y
AU  - Gourlay,CM
AU  - Britton,TB
DO  - 10.1016/j.scriptamat.2019.09.003
EP  - 60
PY  - 2020///
SN  - 1359-6462
SP  - 55
TI  - In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
T2  - Scripta Materialia
UR  - http://dx.doi.org/10.1016/j.scriptamat.2019.09.003
UR  - http://hdl.handle.net/10044/1/74068
VL  - 175
ER  -
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