BibTex format
@article{Gu:2021:10.1007/s11664-020-08697-4,
author = {Gu, T and Gourlay, CM and Britton, TB},
doi = {10.1007/s11664-020-08697-4},
journal = {Journal of Electronic Materials},
pages = {926--938},
title = {The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures},
url = {http://dx.doi.org/10.1007/s11664-020-08697-4},
volume = {50},
year = {2021}
}