More information on http://www.ee.ic.ac.uk/bruno.clerckx
Prof. Bruno Clerckx is Professor of Wireless Communications and Signal Processing, the Head of the Wireless Communications and Signal Processing Lab, and the Deputy Head of the Communications and Signal Processing Group, within the Electrical and Electronic Engineering Department, Imperial College London, London, U.K.
He is also the Chief Technology Officer (CTO) of Silicon Austria Labs (SAL) where he is responsible for all research areas of Austria's top research center for electronic based systems.
He received the M.Sc. and Ph.D. degrees in Electrical Engineering from the Université Catholique de Louvain (UCLouvain), Belgium, and the Doctor of Science (DSc) degree from Imperial College London, U.K. From 2006 to 2011, he was with Samsung Electronics, Suwon, South Korea, where he actively contributed to 4G (3GPP LTE/LTE-A and IEEE 802.16m) and acted as the Rapporteur for the 3GPP Coordinated Multi-Point (CoMP) Study Item. Since 2011, he has been with Imperial College London. From 2014 to 2016, he also was a Professor with Korea University, Seoul, South Korea, and from 2021 to 2022, he was a visiting Professor at Seoul National University, South Korea. He also held various long or short-term visiting research appointments at Stanford University, EURECOM, National University of Singapore, The University of Hong Kong, Princeton University, The University of Edinburgh, The University of New South Wales, and Tsinghua University.
He has authored two books on “MIMO Wireless Communications” and “MIMO Wireless Networks”, 250 peer-reviewed international research papers, and 150 standards contributions, and is the inventor of 80 issued or pending patents among which 15 have been adopted in the specifications of 4G standards and are used by billions of devices worldwide.
His research spans the general area of wireless communications and signal processing for wireless networks. He has been a Technical Program Committee (TPC) member, a symposium chair, or a TPC chair of many symposia on communication theory, signal processing for communication and wireless communication for several leading international IEEE conferences. He was an Elected Member of the IEEE Signal Processing Society SPCOM (Signal Processing for Communications and Networking) Technical Committee. He served as an Editor for the IEEE TRANSACTIONS ON COMMUNICATIONS, the IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, and the IEEE TRANSACTIONS ON SIGNAL PROCESSING. He has also been a (lead) guest editor for special issues of the EURASIP Journal on Wireless Communications and Networking, IEEE ACCESS, the IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS and the IEEE JOURNAL OF SELECTED TOPICS IN SIGNAL PROCESSING, and the PROCEEDINGS OF THE IEEE. He was an Editor for the 3GPP LTE-Advanced Standard Technical Report on CoMP. He is founding chair of IEEE special interest groups on Rate Splitting Multiple Access (RSMA) and Beyond Diagonal Reconfigurable Intelligent Surface (BD-RIS), both being promising technologies for 6G and beyond.
He received the prestigious Blondel Medal 2021 from France for exceptional work contributing to the progress of Science and Electrical and Electronic Industries, the 2021 Adolphe Wetrems Prize in mathematical and physical sciences from Royal Academy of Belgium, multiple awards from Samsung, IEEE best student paper award, and the EURASIP (European Association for Signal Processing) best paper award 2022. He is a Fellow of the IEEE and the IET, and an IEEE Communications Society Distinguished Lecturer 2021-2022.
et al., 2023, Joint transmit and receive beamforming design in full-duplex integrated sensing and communications, Ieee Journal on Selected Areas in Communications, Vol:41, ISSN:0733-8716, Pages:2907-2919
Liu Z, Bhandari A, Clerckx B, 2023, λ–MIMO: massive MIMO via modulo sampling, Ieee Transactions on Communications, ISSN:0090-6778
et al., 2023, Improved Spectral Efficiency in STAR-RIS Aided Uplink Communication Using Rate Splitting Multiple Access, Ieee Transactions on Wireless Communications, Vol:22, ISSN:1536-1276, Pages:5365-5382
Li H, Shen S, Clerckx B, 2023, Beyond Diagonal Reconfigurable Intelligent Surfaces: A Multi-Sector Mode Enabling Highly Directional Full-Space Wireless Coverage, Ieee Journal on Selected Areas in Communications, Vol:41, ISSN:0733-8716, Pages:2446-2460
Salem A, Masouros C, Clerckx B, 2023, Secure Rate Splitting Multiple Access: How Much of the Split Signal to Reveal?, Ieee Transactions on Wireless Communications, Vol:22, ISSN:1536-1276, Pages:4173-4187