Summary
Prof. Bruno Clerckx is Professor of Wireless Communications and Signal Processing, the Head of the Communications and Signal Processing Group, and the Head of the Wireless Communications and Signal Processing Lab, within the Electrical and Electronic Engineering Department, Imperial College London, London, U.K.
He spent many years in industry with Silicon Austria Labs (SAL), Austria, where he was the Chief Technology Officer (CTO) responsible for all research areas of Austria's top research center for electronic based systems, and with Samsung Electronics, South Korea, where he actively contributed to 4G (3GPP LTE/LTE-A and IEEE 802.16m) standardization.
He also was a Professor at Korea University and a visiting Professor at Seoul National University, South Korea, and held various long or short-term visiting research appointments at Stanford University, EURECOM, National University of Singapore, The University of Hong Kong, Princeton University, The University of Edinburgh, The University of New South Wales, and Tsinghua University.
He has authored two books on “MIMO Wireless Communications” and “MIMO Wireless Networks”, 300 peer-reviewed international research papers, and 150 standards contributions, and is the inventor of 80 issued or pending patents among which several have been adopted in the specifications of 4G (and still in use in 5G) standards and are used by billions of devices worldwide.
His research spans the general area of wireless communications and signal processing for wireless networks. He has been a Technical Program Committee (TPC) member, a symposium chair, or a TPC chair of many symposia on communication theory, signal processing for communications and wireless communications for several leading international IEEE conferences. He was an Elected Member of the IEEE Signal Processing Society SPCOM (Signal Processing for Communications and Networking) Technical Committee. He served as an Editor for the IEEE TRANSACTIONS ON COMMUNICATIONS, the IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS, and the IEEE TRANSACTIONS ON SIGNAL PROCESSING. He has also been a (lead) guest editor for special issues of the EURASIP Journal on Wireless Communications and Networking, IEEE ACCESS, the IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS and the IEEE JOURNAL OF SELECTED TOPICS IN SIGNAL PROCESSING, and the PROCEEDINGS OF THE IEEE. He was an Editor for the 3GPP LTE-Advanced Standard Technical Report on CoMP. He is the founding chair of IEEE special interest groups on Rate Splitting Multiple Access (RSMA) and Beyond Diagonal Reconfigurable Intelligent Surface (BD-RIS), both being promising technologies for 6G and beyond.
He received the prestigious Blondel Medal 2021 from France for exceptional work contributing to the progress of Science and Electrical and Electronic Industries, the 2021 Adolphe Wetrems Prize in mathematical and physical sciences from Royal Academy of Belgium, multiple awards from Samsung, IEEE best student paper award, and the EURASIP (European Association for Signal Processing) best paper award 2022. He is a Fellow of the IEEE and the IET, and an IEEE Communications Society Distinguished Lecturer 2021-2023.
He received the M.Sc. and Ph.D. degrees in Electrical Engineering from the Université Catholique de Louvain (UCLouvain), Belgium, and the Doctor of Science (DSc) degree from Imperial College London, U.K.
Publications
Journals
Liu Z, 2024, Integrated Sensing and Communications Enabled Low Earth Orbit Satellite Systems, Ieee Network: the Magazine of Global Information Exchange, ISSN:0890-8044
Liu Y, Clerckx B, Popovski P, 2024, Network Slicing for eMBB, URLLC, and mMTC: An Uplink Rate-Splitting Multiple Access Approach, Ieee Transactions on Wireless Communications, Vol:23, ISSN:1536-1276, Pages:2140-2152
Cerna Loli R, Clerckx B, 2024, A Meta-Learning-Based Precoder Optimization Framework for Rate-Splitting Multiple Access, Ieee Wireless Communications Letters, Vol:13, ISSN:2162-2337, Pages:347-351
Nerini M, Shen S, Clerckx B, 2024, Closed-Form Global Optimization of Beyond Diagonal Reconfigurable Intelligent Surfaces, Ieee Transactions on Wireless Communications, Vol:23, ISSN:1536-1276, Pages:1037-1051
Mishra A, Mao Y, D'Andrea C, et al., 2024, Transmitter Side Beyond-Diagonal Reconfigurable Intelligent Surface for Massive MIMO Networks, Ieee Wireless Communications Letters, Vol:13, ISSN:2162-2337, Pages:352-356