Imperial College London
Portrait Picture

ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Publication Type
Year
to

162 results found

Gourlay CM, Nogita K, Dahle AK, Yamamoto Y, Uesugi K, Nagira T, Yoshiya M, Yasuda Het al., 2011, In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni, ACTA MATERIALIA, Vol: 59, Pages: 4043-4054, ISSN: 1359-6454

Journal article

Meylan B, Terzi S, Gourlay CM, Dahle AKet al., 2011, Dilatancy and rheology at 0-60% solid during equiaxed solidification, ACTA MATERIALIA, Vol: 59, Pages: 3091-3101, ISSN: 1359-6454

Journal article

Meylan B, Terzi S, Gourlay CM, Suery M, Dahle AKet al., 2010, Development of shear bands during deformation of partially solid alloys, SCRIPTA MATERIALIA, Vol: 63, Pages: 1185-1188, ISSN: 1359-6462

Journal article

Otarawanna S, Laukli HI, Gourlay CM, Dahle AKet al., 2010, Feeding Mechanisms in High-Pressure Die Castings, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, Vol: 41A, Pages: 1836-1846, ISSN: 1073-5623

Journal article

Schwingenschloegl U, Di Paola C, Nogita K, Gourlay CMet al., 2010, The influence of Ni additions on the relative stability of η and η<SUP>'</SUP> Cu<sub>6</sub>Sn<sub>5</sub>, APPLIED PHYSICS LETTERS, Vol: 96, ISSN: 0003-6951

Journal article

Gourlay CM, Nogita K, Read J, Dahle AKet al., 2010, Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys, JOURNAL OF ELECTRONIC MATERIALS, Vol: 39, Pages: 56-69, ISSN: 0361-5235

Journal article

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2010, Agglomeration and bending of equiaxed crystals during solidification of hypoeutectic Al and Mg alloys, ACTA MATERIALIA, Vol: 58, Pages: 261-271, ISSN: 1359-6454

Journal article

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2010, The Influence of External Mechanical Stresses on Agglomeration and Bending of Solidifying Crystals, PRICM 7, PTS 1-3, Vol: 654-656, Pages: 1367-+, ISSN: 0255-5476

Journal article

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2009, The use of electron back-scattered diffraction (EBSD) for grain size measurements in Al-Si and Mg-Al high pressure die castings, Pages: 1082-1087

It has been established that Electron Back-Scattered Diffraction (EBSD) is the most reliable technique for measuring grain size in high pressure die cast (HPDC) components. However, small pseudo grains are often observed in EBSD maps due to the effects of inaccurate EBSD indexing and result extrapolation. These pseudo grains must be excluded when determining the average grain size. Also, grains forming in the melt prior to injection, so-called externally solidified crystals (ESCs), should be excluded in order to calculate the in-cavity solidified grain size. In this paper, we develop and analyze procedures for the use of the EBSD technique for determination of in-cavity solidified grain size, including the exclusion of small pseudo-grains and ESCs. Grain size measurements of HPDC Al-Si and Mg-Al components are shown. The size of in-cavity solidified grains in AlSi4MgMn and MgA15Mn are found to be fairly uniform across the cross-sections, determined to be 11 ± 1.5 μm and 9 ± 1 μm respectively.

Conference paper

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2009, The thickness of defect bands in high-pressure die castings, MATERIALS CHARACTERIZATION, Vol: 60, Pages: 1432-1441, ISSN: 1044-5803

Journal article

Nogita K, Ockert S, Pierce J, Greaves MC, Gourlay CM, Dahle AKet al., 2009, Engineering the Mg-Mg<sub>2</sub>Ni eutectic transformation to produce improved hydrogen storage alloys, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, Vol: 34, Pages: 7686-7691, ISSN: 0360-3199

Journal article

Nishimura T, Suenaga S, Nogita K, Gourlay CM, Read J, Dahle AKet al., 2009, Method of regulating nickel concentration in lead-free solder containing nickel, WO/2009/104271

Patent

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2009, Microstructure Formation in AlSi4MgMn and AlMg5Si2Mn High-Pressure Die Castings, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, Vol: 40A, Pages: 1645-1659, ISSN: 1073-5623

Journal article

Yasuda H, Nogita K, Gourlay C, Yoshiya M, Nagira Tet al., 2009, In-situ observation of Sn alloy solidification at SPring-8, Yosetsu Gakkai Shi/Journal of the Japan Welding Society, Vol: 78, Pages: 6-9, ISSN: 0021-4787

Journal article

Nogita K, Gourlay CM, Nishimura T, 2009, Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates, JOM, Vol: 61, Pages: 45-51, ISSN: 1047-4838

Journal article

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2009, The Influence of Intensification Pressure on the Gate Microstructure of AlSi3MgMn High Pressure Die Castings, 4th International Light Metals Technology Conference (LMT 2009), Publisher: TRANS TECH PUBLICATIONS LTD, Pages: 607-+, ISSN: 0255-5476

Conference paper

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2009, Microstructure formation in high pressure die casting, 4th International Conference on Solidification Science and Processing (ICSSP4), Publisher: Transactions of The Indian Institute of Metals, Pages: 499-503, ISSN: 0972-2815

Conference paper

Ventura T, Gourlay CM, Nogita K, Rappaz M, Dahle AKet al., 2008, The inluence of Ni additions on the solidification of Sn-0.7Cu solder, Pages: 186-189, ISSN: 0883-2900

Recent legislation in Europe and Japan banning the use of lead in electronic circuit boards (used, for example, in computers and mobile phones) is forcing the industry to develop competitive replacement solder alloys. Pb-free solders based on near-eutectic Sn-0.7Cu-xNi alloys provide excellent solderability during wave soldering with cost advantages compared to Ag-containing alternatives. However, there is only limited knowledge about the solidification mechanisms in this alloy system and, furthermore, the ternary Sn-Cu-Ni phase diagram is not yet fully established. The influence of Ni additions on the solidification mechanisms in the Sn-0.7Cu alloy has been studied by microstructural analysis, fluidity measurements, directional solidification experiments and X-ray fluorescence imaging. The addition of 500-600 ppm Ni to Sn-0.7Cu creates a eutectic microstructure, changes the solidification mechanism and improves the fluidity during solidification. The microstructural observations allow for comparison with previous Bridgman studies on binary Sn-0.9Cu. The influence of Ni addition on the solidification mechanisms is then assessed by comparing the microstructures of the ternary and binary alloys. Finally, the ternary alloy microstructures are used to discuss the contrasting Sn-Cu-Ni phase diagrams reported in the literature. The results demonstrate the complex phase relations in the Sn-Cu alloy system and the important role of a few hundred ppm of various solute elements. © Institute of Materials Engineering Australasia Ltd.

Conference paper

Meylan B, Gourlay CM, Dahle AK, 2008, Understanding rheology and solidification of light alloys, Pages: 190-193, ISSN: 0883-2900

During solidification of equiaxed dendritic alloys, the rheological behaviour changes from that of a fully liquid to a solid across a range of temperatures and therefore occurs over a significant period of time. Within the solidification range there are a number of characteristic transitions delineating different rheological responses. In commercial casting processes, solidifying metals usually experience deformation as they are subjected to stresses, thermal contraction, solidification shrinkage or flow. The deformation of partially solid alloys can lead to a variety of casting defects including hot tearing, microshrinkage porosity and many forms of macrosegregation. With the increased requirements of cast light metal components, there is a need for an improved understanding of the phenomena occurring during solidification. The rheology at high solid fraction where hot tearing occurs, usually fs > 0.9, has received much attention and is reasonably well understood. Further, rheology of globular alloys for semi-solid metal processing with solid fractions fs∼ 0.5, where the semi-solid behaves as a suspension, is also well investigated. However, much less work has been conducted to understand the rheology of equiaxed dendritic alloys during solidification in order to understand defect formation and its relation to the mechanical response of the alloys. This paper reports on the relationship between rheology and microstructural development during solidification of light metals for intermediate solid fractions where the partially solid alloys behave like granular materials. Further, the relation between defect formation and its relation to microstructure development is discussed. © Institute of Materials Engineering Australasia Ltd.

Conference paper

Gourlay CM, Meylan B, Dahle AK, 2008, Shear mechanisms at 0-50% solid during equiaxed dendritic solidification of an AZ91 magnesium alloy, ACTA MATERIALIA, Vol: 56, Pages: 3403-3413, ISSN: 1359-6454

Journal article

Nogita K, Gourlay CM, Read J, Nishimura T, Suenaga S, Dahle AKet al., 2008, Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder, MATERIALS TRANSACTIONS, Vol: 49, Pages: 443-448, ISSN: 1345-9678

Journal article

Gourlay CM, Read J, Nogita K, Dahle AKet al., 2008, The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys, JOURNAL OF ELECTRONIC MATERIALS, Vol: 37, Pages: 51-60, ISSN: 0361-5235

Journal article

Ventura T, Gourlay CM, Nogita K, Nishimura T, Rappaz M, Dahle AKet al., 2008, The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-<i>x</i>Ni, JOURNAL OF ELECTRONIC MATERIALS, Vol: 37, Pages: 32-39, ISSN: 0361-5235

Journal article

Otarawanna S, Gourlay CM, Laukli HI, Dahle AKet al., 2008, The Use of Electron-backscattered Diffraction (EBSD) for Grain Size Measurements in Al-Si and Mg-Al High Pressure Die Castings, PMP-III: The 3rd International Conference on Processing Materials for Properties, Publisher: TMS, USA, Pages: 1277-1282

Conference paper

Gourlay CM, Otarawanna S, Meylan B, Dahle AKet al., 2008, Reynolds' Dilatancy and Shear Bands in Semi-solid Alloys, 10th International Conference on Semi-Solid Processing of Alloys and Composites, Publisher: TRANS TECH PUBLICATIONS LTD, Pages: 337-342, ISSN: 1012-0394

Conference paper

Gourlay CM, Laukli HI, Dahle AK, 2007, Defect band characteristics in Mg-Al and Al-Si high-pressure die castings, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, Vol: 38A, Pages: 1833-1844, ISSN: 1073-5623

Journal article

Gourlay CM, Dahle AK, 2007, Dilatant shear bands in solidifying metals, NATURE, Vol: 445, Pages: 70-73, ISSN: 0028-0836

Journal article

Gourlay CM, Dahle AK, 2007, Dilatancy and strain localization in equiaxed solidifying alloys, 5th Decennial International Conference on Solidification Processing, Publisher: University of Sheffield, Pages: 610-614

Conference paper

Gourlay CM, Meylan B, Dahle AK, 2007, Rheological transitions at low solid fraction in solidifying magnesium alloy AZ91, 6th Pacific Rim International Conference on Advanced Materials and Processing, Publisher: TRANS TECH PUBLICATIONS LTD, Pages: 1067-1070, ISSN: 0255-5476

Conference paper

Ventura T, Nogita K, Gourlay CM, Nishimura T, Rappaz M, Dahle AKet al., 2007, Solidification characteristics of lead-free solder Sn-0.7Cu with trace Ni doping, 5th Decennial International Conference on Solidification Processing, Publisher: University of Sheffield, Pages: 651-655

Conference paper

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