Publications
160 results found
Meylan B, Terzi S, Gourlay CM, et al., 2010, Development of shear bands during deformation of partially solid alloys, SCRIPTA MATERIALIA, Vol: 63, Pages: 1185-1188, ISSN: 1359-6462
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- Citations: 18
Otarawanna S, Laukli HI, Gourlay CM, et al., 2010, Feeding Mechanisms in High-Pressure Die Castings, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, Vol: 41A, Pages: 1836-1846, ISSN: 1073-5623
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- Citations: 37
Schwingenschloegl U, Di Paola C, Nogita K, et al., 2010, The influence of Ni additions on the relative stability of η and η<SUP>'</SUP> Cu<sub>6</sub>Sn<sub>5</sub>, APPLIED PHYSICS LETTERS, Vol: 96, ISSN: 0003-6951
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- Citations: 55
Gourlay CM, Nogita K, Read J, et al., 2010, Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys, JOURNAL OF ELECTRONIC MATERIALS, Vol: 39, Pages: 56-69, ISSN: 0361-5235
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- Citations: 39
Otarawanna S, Gourlay CM, Laukli HI, et al., 2010, Agglomeration and bending of equiaxed crystals during solidification of hypoeutectic Al and Mg alloys, ACTA MATERIALIA, Vol: 58, Pages: 261-271, ISSN: 1359-6454
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- Citations: 15
Otarawanna S, Gourlay CM, Laukli HI, et al., 2010, The Influence of External Mechanical Stresses on Agglomeration and Bending of Solidifying Crystals, PRICM 7, PTS 1-3, Vol: 654-656, Pages: 1367-+, ISSN: 0255-5476
Otarawanna S, Gourlay CM, Laukli HI, et al., 2009, The use of electron back-scattered diffraction (EBSD) for grain size measurements in Al-Si and Mg-Al high pressure die castings, Pages: 1082-1087
It has been established that Electron Back-Scattered Diffraction (EBSD) is the most reliable technique for measuring grain size in high pressure die cast (HPDC) components. However, small pseudo grains are often observed in EBSD maps due to the effects of inaccurate EBSD indexing and result extrapolation. These pseudo grains must be excluded when determining the average grain size. Also, grains forming in the melt prior to injection, so-called externally solidified crystals (ESCs), should be excluded in order to calculate the in-cavity solidified grain size. In this paper, we develop and analyze procedures for the use of the EBSD technique for determination of in-cavity solidified grain size, including the exclusion of small pseudo-grains and ESCs. Grain size measurements of HPDC Al-Si and Mg-Al components are shown. The size of in-cavity solidified grains in AlSi4MgMn and MgA15Mn are found to be fairly uniform across the cross-sections, determined to be 11 ± 1.5 μm and 9 ± 1 μm respectively.
Otarawanna S, Gourlay CM, Laukli HI, et al., 2009, The thickness of defect bands in high-pressure die castings, MATERIALS CHARACTERIZATION, Vol: 60, Pages: 1432-1441, ISSN: 1044-5803
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- Citations: 42
Nogita K, Ockert S, Pierce J, et al., 2009, Engineering the Mg-Mg<sub>2</sub>Ni eutectic transformation to produce improved hydrogen storage alloys, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, Vol: 34, Pages: 7686-7691, ISSN: 0360-3199
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- Citations: 58
Nishimura T, Suenaga S, Nogita K, et al., 2009, Method of regulating nickel concentration in lead-free solder containing nickel, WO/2009/104271
Otarawanna S, Gourlay CM, Laukli HI, et al., 2009, Microstructure Formation in AlSi4MgMn and AlMg5Si2Mn High-Pressure Die Castings, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, Vol: 40A, Pages: 1645-1659, ISSN: 1073-5623
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- Citations: 73
Yasuda H, Nogita K, Gourlay C, et al., 2009, In-situ observation of Sn alloy solidification at SPring-8, Yosetsu Gakkai Shi/Journal of the Japan Welding Society, Vol: 78, Pages: 6-9, ISSN: 0021-4787
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- Citations: 7
Nogita K, Gourlay CM, Nishimura T, 2009, Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates, JOM, Vol: 61, Pages: 45-51, ISSN: 1047-4838
Otarawanna S, Gourlay CM, Laukli HI, et al., 2009, The Influence of Intensification Pressure on the Gate Microstructure of AlSi3MgMn High Pressure Die Castings, 4th International Light Metals Technology Conference (LMT 2009), Publisher: TRANS TECH PUBLICATIONS LTD, Pages: 607-+, ISSN: 0255-5476
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- Citations: 3
Otarawanna S, Gourlay CM, Laukli HI, et al., 2009, Microstructure formation in high pressure die casting, 4th International Conference on Solidification Science and Processing (ICSSP4), Publisher: Transactions of The Indian Institute of Metals, Pages: 499-503, ISSN: 0972-2815
Ventura T, Gourlay CM, Nogita K, et al., 2008, The inluence of Ni additions on the solidification of Sn-0.7Cu solder, Pages: 186-189, ISSN: 0883-2900
Recent legislation in Europe and Japan banning the use of lead in electronic circuit boards (used, for example, in computers and mobile phones) is forcing the industry to develop competitive replacement solder alloys. Pb-free solders based on near-eutectic Sn-0.7Cu-xNi alloys provide excellent solderability during wave soldering with cost advantages compared to Ag-containing alternatives. However, there is only limited knowledge about the solidification mechanisms in this alloy system and, furthermore, the ternary Sn-Cu-Ni phase diagram is not yet fully established. The influence of Ni additions on the solidification mechanisms in the Sn-0.7Cu alloy has been studied by microstructural analysis, fluidity measurements, directional solidification experiments and X-ray fluorescence imaging. The addition of 500-600 ppm Ni to Sn-0.7Cu creates a eutectic microstructure, changes the solidification mechanism and improves the fluidity during solidification. The microstructural observations allow for comparison with previous Bridgman studies on binary Sn-0.9Cu. The influence of Ni addition on the solidification mechanisms is then assessed by comparing the microstructures of the ternary and binary alloys. Finally, the ternary alloy microstructures are used to discuss the contrasting Sn-Cu-Ni phase diagrams reported in the literature. The results demonstrate the complex phase relations in the Sn-Cu alloy system and the important role of a few hundred ppm of various solute elements. © Institute of Materials Engineering Australasia Ltd.
Meylan B, Gourlay CM, Dahle AK, 2008, Understanding rheology and solidification of light alloys, Pages: 190-193, ISSN: 0883-2900
During solidification of equiaxed dendritic alloys, the rheological behaviour changes from that of a fully liquid to a solid across a range of temperatures and therefore occurs over a significant period of time. Within the solidification range there are a number of characteristic transitions delineating different rheological responses. In commercial casting processes, solidifying metals usually experience deformation as they are subjected to stresses, thermal contraction, solidification shrinkage or flow. The deformation of partially solid alloys can lead to a variety of casting defects including hot tearing, microshrinkage porosity and many forms of macrosegregation. With the increased requirements of cast light metal components, there is a need for an improved understanding of the phenomena occurring during solidification. The rheology at high solid fraction where hot tearing occurs, usually fs > 0.9, has received much attention and is reasonably well understood. Further, rheology of globular alloys for semi-solid metal processing with solid fractions fs∼ 0.5, where the semi-solid behaves as a suspension, is also well investigated. However, much less work has been conducted to understand the rheology of equiaxed dendritic alloys during solidification in order to understand defect formation and its relation to the mechanical response of the alloys. This paper reports on the relationship between rheology and microstructural development during solidification of light metals for intermediate solid fractions where the partially solid alloys behave like granular materials. Further, the relation between defect formation and its relation to microstructure development is discussed. © Institute of Materials Engineering Australasia Ltd.
Gourlay CM, Meylan B, Dahle AK, 2008, Shear mechanisms at 0-50% solid during equiaxed dendritic solidification of an AZ91 magnesium alloy, ACTA MATERIALIA, Vol: 56, Pages: 3403-3413, ISSN: 1359-6454
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- Citations: 50
Nogita K, Gourlay CM, Read J, et al., 2008, Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder, MATERIALS TRANSACTIONS, Vol: 49, Pages: 443-448, ISSN: 1345-9678
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- Citations: 21
Gourlay CM, Read J, Nogita K, et al., 2008, The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys, JOURNAL OF ELECTRONIC MATERIALS, Vol: 37, Pages: 51-60, ISSN: 0361-5235
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- Citations: 31
Ventura T, Gourlay CM, Nogita K, et al., 2008, The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-<i>x</i>Ni, JOURNAL OF ELECTRONIC MATERIALS, Vol: 37, Pages: 32-39, ISSN: 0361-5235
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- Citations: 54
Otarawanna S, Gourlay CM, Laukli HI, et al., 2008, The Use of Electron-backscattered Diffraction (EBSD) for Grain Size Measurements in Al-Si and Mg-Al High Pressure Die Castings, PMP-III: The 3rd International Conference on Processing Materials for Properties, Publisher: TMS, USA, Pages: 1277-1282
Gourlay CM, Otarawanna S, Meylan B, et al., 2008, Reynolds' Dilatancy and Shear Bands in Semi-solid Alloys, 10th International Conference on Semi-Solid Processing of Alloys and Composites, Publisher: TRANS TECH PUBLICATIONS LTD, Pages: 337-342, ISSN: 1012-0394
Gourlay CM, Laukli HI, Dahle AK, 2007, Defect band characteristics in Mg-Al and Al-Si high-pressure die castings, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, Vol: 38A, Pages: 1833-1844, ISSN: 1073-5623
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- Citations: 105
Gourlay CM, Dahle AK, 2007, Dilatant shear bands in solidifying metals, NATURE, Vol: 445, Pages: 70-73, ISSN: 0028-0836
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- Citations: 177
Gourlay CM, Dahle AK, 2007, Dilatancy and strain localization in equiaxed solidifying alloys, 5th Decennial International Conference on Solidification Processing, Publisher: University of Sheffield, Pages: 610-614
Gourlay CM, Meylan B, Dahle AK, 2007, Rheological transitions at low solid fraction in solidifying magnesium alloy AZ91, 6th Pacific Rim International Conference on Advanced Materials and Processing, Publisher: TRANS TECH PUBLICATIONS LTD, Pages: 1067-1070, ISSN: 0255-5476
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- Citations: 2
Ventura T, Nogita K, Gourlay CM, et al., 2007, Solidification characteristics of lead-free solder Sn-0.7Cu with trace Ni doping, 5th Decennial International Conference on Solidification Processing, Publisher: University of Sheffield, Pages: 651-655
Gourlay CM, Nogita K, McDonald SD, et al., 2006, A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu, SCRIPTA MATERIALIA, Vol: 54, Pages: 1557-1562, ISSN: 1359-6462
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- Citations: 16
Laukli HI, Gourlay CM, Dahle AK, et al., 2005, Effects of Si content on defect band formation in hypoeutectic Al-Si die castings, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, Vol: 413, Pages: 92-97, ISSN: 0921-5093
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- Citations: 49
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