Publications

BibTex format

@inproceedings{Belyakov:2018,
author = {Belyakov, SA and Nishimura, T and Akaiwa, T and Sweatman, K and Nogita, K and Gourlay, CM},
pages = {211--215},
publisher = {IEEE},
title = {Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability},
url = {https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000851394800050&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb},
year = {2018}
}

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TY  - CPAPER
AU  - Belyakov,SA
AU  - Nishimura,T
AU  - Akaiwa,T
AU  - Sweatman,K
AU  - Nogita,K
AU  - Gourlay,CM
EP  - 215
PB  - IEEE
PY  - 2018///
SP  - 211
TI  - Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability
UR  - https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000851394800050&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb
ER  -

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ProfessorChristopherGourlay

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