Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Xian:2018:10.1016/j.intermet.2018.08.002,
author = {Xian, J and Mohd, Salleh A and Belyakov, S and Su, T and Zeng, G and Nogita, K and Yasuda, H and Gourlay, C},
doi = {10.1016/j.intermet.2018.08.002},
journal = {Intermetallics},
pages = {34--45},
title = {Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn0.7Cu-0.05Ni},
url = {http://dx.doi.org/10.1016/j.intermet.2018.08.002},
volume = {102},
year = {2018}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - The influence of Ni on the size and twinning of primary Cu6Sn5 crystals in Sn-0.7Cu-0.05Ni and Sn-xCu (x=0.7, 0.9, 1.1) (mass%) solder joints is studied using synchrotron radiography and SEM-based EBSD. It is shown that the Ni addition does not cause significant refinement of primary Cu6Sn5 if the alloy is fully melted. However, for peak temperatures ≤250°C relevant to industrial soldering, primary Cu6Sn5 are not completely melted in Sn-0.7Cu-0.05Ni and there are 10–100 times more numerous and smaller crystals than in Sn-0.7Cu. X-shaped Cu6Sn5 crystals with an angle of ∼70° commonly formed in Sn-0.7Cu-0.05Ni/Cu joints and are shown to be penetration twins. This type of growth twinning was only found in partially melted samples, both in Sn-0.7Cu-0.05Ni/Cu joints and binary Sn-1.1Cu alloy. The frequency of twinned crystals was significantly higher in Ni-containing solders. The results are discussed in terms of the influence of Ni on the Cu6Sn5 liquidus slope and on the lattice parameters of (Cu,Ni)6Sn5.
AU  - Xian,J
AU  - Mohd,Salleh A
AU  - Belyakov,S
AU  - Su,T
AU  - Zeng,G
AU  - Nogita,K
AU  - Yasuda,H
AU  - Gourlay,C
DO  - 10.1016/j.intermet.2018.08.002
EP  - 45
PY  - 2018///
SN  - 0966-9795
SP  - 34
TI  - Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn0.7Cu-0.05Ni
T2  - Intermetallics
UR  - http://dx.doi.org/10.1016/j.intermet.2018.08.002
UR  - http://hdl.handle.net/10044/1/63287
VL  - 102
ER  -
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