BibTex format
@article{Belyakov:2019:10.1007/s10854-018-0302-8,
author = {Belyakov, S and Xian, J and Zeng, G and Sweatman, K and Nishimura, T and Akaiwa, T and Gourlay, C},
doi = {10.1007/s10854-018-0302-8},
journal = {Journal of Materials Science: Materials in Electronics},
pages = {378--390},
title = {Precipitation and coarsening of bismuth plates in Sn-Ag-Cu-Bi and Sn-Cu-Ni-Bi solder joints},
url = {http://dx.doi.org/10.1007/s10854-018-0302-8},
volume = {30},
year = {2019}
}