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BibTex format

@article{Xian:2020:10.1007/s11664-020-08498-9,
author = {Xian, JW and Belyakov, SA and Gourlay, CM},
doi = {10.1007/s11664-020-08498-9},
journal = {Journal of Electronic Materials},
pages = {786--795},
title = {Time-lapse imaging of Ag3Sn thermal coarsening in Sn-3Ag-0.5Cu solder joints},
url = {http://dx.doi.org/10.1007/s11664-020-08498-9},
volume = {50},
year = {2020}
}

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TY  - JOUR
AB  - The coarsening of Ag3Sn particles occurs during the operation of joints and plays an important role in failure. Here, Ag3Sn coarsening is studied at 125°C in the eutectic regions of Sn-3Ag-0.5Cu/Cu solder joints by SEM-based time-lapse imaging. Using multi-step thresholding segmentation and image analysis, it is shown that coalescence of Ag3Sn particles is an important ripening process in addition to LSW-like Ostwald ripening. About 10% of the initial Ag3Sn particles coalesced during ageing, coalescence occurred uniformly across eutectic regions, and the scaled size distribution histograms contained large particles that can be best fit by the Takajo model of coalescence ripening. Similar macroscopic coarsening kinetics were measured between the surface and bulk Ag3Sn particles. Tracking of individual surface particles showed an interplay between the growth/shrinkage and coalescence of Ag3Sn.
AU  - Xian,JW
AU  - Belyakov,SA
AU  - Gourlay,CM
DO  - 10.1007/s11664-020-08498-9
EP  - 795
PY  - 2020///
SN  - 0361-5235
SP  - 786
TI  - Time-lapse imaging of Ag3Sn thermal coarsening in Sn-3Ag-0.5Cu solder joints
T2  - Journal of Electronic Materials
UR  - http://dx.doi.org/10.1007/s11664-020-08498-9
UR  - https://link.springer.com/article/10.1007%2Fs11664-020-08498-9
UR  - http://hdl.handle.net/10044/1/84151
VL  - 50
ER  -

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ProfessorChristopherGourlay

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