Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Xu:2022:10.1016/j.ijplas.2022.103308,
author = {Xu, Y and Xian, J and Stoyanov, S and Bailey, C and Coyle, R and Gourlay, C and Dunne, F},
doi = {10.1016/j.ijplas.2022.103308},
journal = {International Journal of Plasticity},
title = {A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints},
url = {http://dx.doi.org/10.1016/j.ijplas.2022.103308},
volume = {155},
year = {2022}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.
AU  - Xu,Y
AU  - Xian,J
AU  - Stoyanov,S
AU  - Bailey,C
AU  - Coyle,R
AU  - Gourlay,C
AU  - Dunne,F
DO  - 10.1016/j.ijplas.2022.103308
PY  - 2022///
SN  - 0749-6419
TI  - A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
T2  - International Journal of Plasticity
UR  - http://dx.doi.org/10.1016/j.ijplas.2022.103308
UR  - http://hdl.handle.net/10044/1/97049
VL  - 155
ER  -
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