Imperial College London
Portrait Picture

ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
//

Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
//

Location

 

301DBessemer BuildingSouth Kensington Campus

//

Summary

 

Publications

Citation

BibTex format

@article{Shang:2017:10.1016/j.jallcom.2017.04.268,
author = {Shang, H and Ma, ZL and Belyakov, SA and Gourlay, CM},
doi = {10.1016/j.jallcom.2017.04.268},
journal = {JOURNAL OF ALLOYS AND COMPOUNDS},
pages = {471--485},
title = {Grain refinement of electronic solders: The potential of combining solute with nucleant particles},
url = {http://dx.doi.org/10.1016/j.jallcom.2017.04.268},
volume = {715},
year = {2017}
}
Download

RIS format (EndNote, RefMan)

TY  - JOUR
AB  - Sn-Ag-Cu electronic solder joints typically solidify from a single nucleation event producing either a single βSn grain or twinned grains. With so few and variable βSn orientations, each joint is mechanically unique due to the anisotropy of tetragonal βSn. Here we explore the potential of increasing the number of βSn orientations in solder joints by promoting heterogeneous nucleation during solidification. It is shown that large (60 g) samples can be grain refined effectively by combining growth restricting solute with potent heterogeneous nucleant particles introduced by alloying additions of Zn, Ti, Co, Ir, Pd, or Pt. These mechanisms are discussed with reference to the grain refinement of structural casting alloys. In 500 μm solder balls, these grain refinement approaches were less effective and a relatively high cooling rate of 17 K/s combined with solute and nucleant particles were required to trigger multiple nucleation events. With this approach, up to 12 independent grains formed in 500 μm balls of Sn-3Ag-0.5Cu alloyed with Pt, Co, or Ti, compared with one independent grain in balls without nucleant particle additions.
AU  - Shang,H
AU  - Ma,ZL
AU  - Belyakov,SA
AU  - Gourlay,CM
DO  - 10.1016/j.jallcom.2017.04.268
EP  - 485
PY  - 2017///
SN  - 0925-8388
SP  - 471
TI  - Grain refinement of electronic solders: The potential of combining solute with nucleant particles
T2  - JOURNAL OF ALLOYS AND COMPOUNDS
UR  - http://dx.doi.org/10.1016/j.jallcom.2017.04.268
UR  - http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000402919400060&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202
UR  - http://hdl.handle.net/10044/1/47948
VL  - 715
ER  -
Download