Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Xian:2017:10.1016/j.intermet.2017.08.002,
author = {Xian, JW and Zeng, G and Belyakov, S and Gu, Q and Nogita, K and Gourlay, C},
doi = {10.1016/j.intermet.2017.08.002},
journal = {Intermetallics},
pages = {50--64},
title = {Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn},
url = {http://dx.doi.org/10.1016/j.intermet.2017.08.002},
volume = {91},
year = {2017}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - The directional coefficient of thermal expansion (CTE) of intermetallics in electronic interconnections is a key thermophysical property that is required for microstructure-level modelling of solder joint reliability. Here, CTE ellipsoids are measured for key solder intermetallics using synchrotron x-ray diffraction (XRD). The role of the crystal structure used for refinement on the CTE shape and temperature dependence is investigated. The results are used to discuss the βSn-IMC orientation relationships (ORs) that minimise the in-plane CTE mismatch on IMC growth facets, which are measured with electron backscatter diffraction (EBSD) in solder joints on Cu and Ni substrates. The CTE mismatch in fully-intermetallic joints is discussed, and the relationship between the directional CTE of monoclinic and hexagonal polymorphs of Cu6Sn5 is explored.
AU  - Xian,JW
AU  - Zeng,G
AU  - Belyakov,S
AU  - Gu,Q
AU  - Nogita,K
AU  - Gourlay,C
DO  - 10.1016/j.intermet.2017.08.002
EP  - 64
PY  - 2017///
SN  - 0966-9795
SP  - 50
TI  - Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
T2  - Intermetallics
UR  - http://dx.doi.org/10.1016/j.intermet.2017.08.002
UR  - http://hdl.handle.net/10044/1/50334
VL  - 91
ER  -
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