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@article{Li:2017:10.1007/s11664-017-5763-7,
author = {Li, Z and Belyakov, S and Xian, J and Gourlay, C},
doi = {10.1007/s11664-017-5763-7},
journal = {Journal of Electronic Materials},
pages = {84--95},
title = {The inuence of primary Cu6Sn5 size on the shear impact properties of Sn-Cu/Cu BGA Joints},
url = {http://dx.doi.org/10.1007/s11664-017-5763-7},
volume = {47},
year = {2017}
}

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TY  - JOUR
AB  - A method is presented to control the size of primary Cu6Sn5 in ball grid array (BGA) joints while keeping all other microstructural features near-constant, enabling a direct study of the size of primary Cu6Sn5 on impact properties. For Sn-2Cu/Cu BGA joints, it is shown that larger primary Cu6Sn5 particles have a clear negative effect on the shear impact properties. Macroscopic fracture occurred by a combination of the brittle fracture of embedded primary Cu6Sn5 rods and ductile fracture of the matrix βSn. Cleavage of the Cu6Sn5 rods occurred mostly along (0001) or perpendicular to (0001) with some crack deflection between the two. The deterioration of shear impact properties with increasing Cu6Sn5 size is attributed to (1) the larger microcracks introduced by the brittle fracture of larger embedded Cu6Sn5 crystals, and (2) the less numerous and more widely spaced rods when the Cu6Sn5 crystals are larger, which makes them poor strengtheners.
AU  - Li,Z
AU  - Belyakov,S
AU  - Xian,J
AU  - Gourlay,C
DO  - 10.1007/s11664-017-5763-7
EP  - 95
PY  - 2017///
SN  - 0361-5235
SP  - 84
TI  - The inuence of primary Cu6Sn5 size on the shear impact properties of Sn-Cu/Cu BGA Joints
T2  - Journal of Electronic Materials
UR  - http://dx.doi.org/10.1007/s11664-017-5763-7
UR  - http://hdl.handle.net/10044/1/50478
VL  - 47
ER  -

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