Imperial College London
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ProfessorChristopherGourlay

Faculty of Engineering, Department of Materials

Professor of Physical Metallurgy
 
 
 
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Contact

 

+44 (0)20 7594 8707c.gourlay

 
 
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Location

 

301DBessemer BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Hou:2018:10.1016/j.actamat.2018.02.034,
author = {Hou, N and Belyakov, S and Pay, L and Sugiyama, A and Yasuda, H and Gourlay, C},
doi = {10.1016/j.actamat.2018.02.034},
journal = {Acta Materialia},
pages = {119--131},
title = {Competition between stable and metastable eutectic growth in Sn-Ni alloys},
url = {http://dx.doi.org/10.1016/j.actamat.2018.02.034},
volume = {149},
year = {2018}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - Metastable Sn-NiSn4 eutectic can form in electronic solder joints and is a reliability concern. Here the competition between stable Sn-Ni3Sn4 and metastable Sn-NiSn4 eutectic growth is studied during unidirectional solidification. The stable and metastable eutectic points are measured, the dynamics of eutectic growth and the transition between the two eutectics is investigated by synchrotron radiography, and the crystallography of eutectic growth is measured by EBSD. It is shown that the Sn-Ni3Sn4 eutectic has a highly irregular morphology with diverging and converging rods because monoclinic Ni3Sn4 grows only along [010] without a reproducible orientation relationship (OR) with Sn. The metastable Sn-NiSn4 eutectic has a more regular broken-lamellar morphology and a reproducible OR with Sn. The critical velocity between the two eutectics is less than 1μm/s which is discussed in terms of the small temperature difference between the two eutectic points and the kinetic growth advantages of the metastable eutectic.
AU  - Hou,N
AU  - Belyakov,S
AU  - Pay,L
AU  - Sugiyama,A
AU  - Yasuda,H
AU  - Gourlay,C
DO  - 10.1016/j.actamat.2018.02.034
EP  - 131
PY  - 2018///
SN  - 1359-6454
SP  - 119
TI  - Competition between stable and metastable eutectic growth in Sn-Ni alloys
T2  - Acta Materialia
UR  - http://dx.doi.org/10.1016/j.actamat.2018.02.034
UR  - http://hdl.handle.net/10044/1/57380
VL  - 149
ER  -
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