BibTex format
@inproceedings{Hong:2021:10.1145/3411764.3445469,
author = {Hong, F and Myant, C and Boyle, D},
doi = {10.1145/3411764.3445469},
pages = {1--10},
title = {Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending},
url = {http://dx.doi.org/10.1145/3411764.3445469},
year = {2021}
}