David Boyle is a Lecturer in the Dyson School of Design Engineering. His research centres around the design of networked monitoring and control systems synonymous with Cyber-Physical Systems and the Internet of Things. This covers a variety of topics, including: designing reliable, secure, energy efficient wireless communication systems; energy transfer, storage and management systems; control and design optimisation.
Applications are welcome from outstanding prospective PhD students and postdoctoral researchers. Please contact Dr Boyle directly if you wish to be considered for a position.
David joined the School from the Department of Electrical and Electronic Engineering at Imperial College London, where he was a Research Fellow since 2012 with research interests at the intersection of wireless sensing, actuation and control systems, data analytics, and the digital economy.
Before joining Imperial, David worked with Wireless Sensor Network and Microelectronics Applications Integration Groups in the Microsystems Centre at Tyndall National Institute, and the Embedded Systems Research Group, University College Cork, Ireland, developing ‘green' wireless sensor networks. Previously, he was with Orange Labs, France, and a Visiting Postdoctoral Scholar at the Higher Technical School of Telecommunications Engineering, Technical University of Madrid (ETSIT UPM).
David received his PhD in Electronic and Computer Engineering from the University of Limerick, Ireland, in 2009, for his work in the area of security for wireless sensor networks, having graduated with a B. Eng. (Hons) in Computer Engineering in 2005.
Qiuchen Q, Akshayaa P, Boyle D, 2021, Optimal recharge scheduler for drone-to-sensor wireless power transfer, Ieee Access, Vol:9, ISSN:2169-3536, Pages:59301-59312
Aloufi R, Haddadi H, Boyle D, 2020, Privacy-preserving Voice Analysis via Disentangled Representations, Proceedings of the 2020 Acm Sigsac Conference on Cloud Computing Security Workshop
et al., 2020, A flexible, low-power platform for UAV-based data collection from remote sensors, Ieee Access, Vol:8, ISSN:2169-3536, Pages:164775-164785
Hong F, Myant C, Boyle D, Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending, CHI Conference on Human Factors in Computing Systems
et al., 2020, An induction-based localisation technique for wirelessly charged drones, Pages:275-277