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BibTex format

@article{Wang:2022:10.1002/aelm.202101253,
author = {Wang, B and Nam, S and Limbu, S and Kim, J-S and Riede, M and Bradley, DDC},
doi = {10.1002/aelm.202101253},
journal = {ADVANCED ELECTRONIC MATERIALS},
title = {Properties and Applications of Copper(I) Thiocyanate Hole-Transport Interlayers Processed from Different Solvents},
url = {http://dx.doi.org/10.1002/aelm.202101253},
volume = {8},
year = {2022}
}

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TY  - JOUR
AU  - Wang,B
AU  - Nam,S
AU  - Limbu,S
AU  - Kim,J-S
AU  - Riede,M
AU  - Bradley,DDC
DO  - 10.1002/aelm.202101253
PY  - 2022///
SN  - 2199-160X
TI  - Properties and Applications of Copper(I) Thiocyanate Hole-Transport Interlayers Processed from Different Solvents
T2  - ADVANCED ELECTRONIC MATERIALS
UR  - http://dx.doi.org/10.1002/aelm.202101253
UR  - https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000770370000001&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb
VL  - 8
ER  -

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