Katarzyna Szostak has graduated her BSc. (Hons) in Electronics and Telecommunication in 2011 at Wroclaw University of Technology, Poland. There, she received the first training in micro-and nanofabrication and conducted degree project on “Design and realization of concave structures with smooth sidewalls by etching of silicon in anisotropic and isotropic processes”. After that, she continued her education on master level studies at the same faculty, in Microsystems, Electronics and Photonics. She graduated in 2012 with distinction after defending a dissertation about glass-to-glass anodic bonding through thin polysilicon layers. During her second-level studies, Katarzyna was awarded a 6-month research scholarship from the Foundation of Polish Science to support work on a novel dose-radiation sensor platform.
Meanwhile, Katarzyna has attended several internships in VTT, Finland and IMEC, Belgium, where she worked on changing the etching behaviour of SOI wafers for photonic integrated circuits and on graphene-based FET transistors, respectively.
In 2013 Katarzyna joined AML Ltd. company in Harwell, UK as a Process Engineer, where her responsibilities focused on various bonding processes for a wide range of materials.
From late 2013 until April 2015, Katarzyna worked at the Ilmenau University of Technology in Germany as a Research Associate. Her work was focused on clean-room microfabrication and characterisation of a novel, miniature spectrometers for air-quality sensing.
In August 2015, Katarzyna joined the Next Generation Neural Interfaces Lab at Imperial College as a Research Associate working on microengineering and system integration for Brain-Computer Interfaces within ENGINI poject. In the meantime, she started a part-time Ph.D. programme on micropackaging technologies for implantable medical devices, concluding her doctorate studies in September 2021.
Microfabrication of implantable neuroengineering devices, brain-computer interfaces, neurotechnology, micro-and nanofabrication, MEMS, medical devices.
Szostak KM, Keshavarz M, Constandinou T, 2021, Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices, Journal of Micromechanics and Microengineering, Vol:31, ISSN:0960-1317, Pages:1-13
Szostak K, Grand L, Constandinou TG, 2017, Neural interfaces for intracortical recording: requirements, fabrication methods, and characteristics, Frontiers in Neuroscience, Vol:11, ISSN:1662-4548
et al., 2019, Towards a distributed, chronically-implantable neural interface, 9th IEEE/EMBS International Conference on Neural Engineering (NER), IEEE, Pages:719-724, ISSN:1948-3546
Szostak KM, Constandinou TG, 2018, Hermetic packaging for implantable microsystems: effectiveness of sequentially electroplated AuSn alloy, 40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), IEEE
et al., 2018, Autonomous SoC for neural local field potential recording in mm-scale wireless implants, IEEE International Symposium on Circuits and Systems, IEEE, Pages:1-5, ISSN:2379-447X