Imperial College London


Faculty of EngineeringDepartment of Electrical and Electronic Engineering

Research Associate



lieuwe.leene11 CV




B422Bessemer BuildingSouth Kensington Campus





Lieuwe is currently working on the ENGINI project which aims to develop a wireless chip scale bio-signal instrumentation system. Using state-of-the-art system on chip and fabrication technologies, this device hopes to realise millimetre sized medical implants for electroceutical and neuromodulation therapy. Lieuwe specialises in mixed signal circuit design and data converters using time-domain techniques for more efficient asynchronous processing. 

Short biography

Lieuwe Leene recently completed his PhD at Imperial College London specialising in developing integrated CMOS circuits for implantable healthcare devices. He received his BEng. Electronic Engineering from the Hong Kong University of Science and Technology and his MSc Analogue and Digital Integrated Circuit Design from Imperial College London. Lieuwe then joined the NGNI Neural Interfaces group at the Center for Bio-Inspired Technology as PhD student. Currently he holds a post-doc position at Imperial with the NGNI group.



Leene LB, Constandinou TG, 2017, Time Domain Processing Techniques Using Ring Oscillator-Based Filter Structures, Ieee Transactions on Circuits and Systems I-regular Papers, Vol:64, ISSN:1549-8328, Pages:3003-3012

Leene LB, Constandinou TG, 2017, A 0.016 mm(2) 12b Delta Sigma SAR With 14 fJ/conv. for Ultra Low Power Biosensor Arrays, Ieee Transactions on Circuits and Systems I-regular Papers, Vol:64, ISSN:1549-8328, Pages:2655-2665


Leene L, Constandinou TG, 2017, A 0.5V time-domain instrumentation circuit with clocked and unclocked ΔΣ operation, IEEE International Symposium on Circuits and Systems (ISCAS), IEEE, Pages:2619-2622, ISSN:2379-447X

Szostak K, Mazza F, Maslik M, et al., 2017, Microwire-CMOS Integration of mm-Scale Neural Probes for Chronic Local Field Potential Recording, IEEE Biomedical Circuits and Systems (BioCAS) Conference, IEEE, Pages:492-495

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