Imperial College London

Prof Milo Shaffer

Faculty of Natural SciencesDepartment of Chemistry

Professor of Materials Chemistry
 
 
 
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Contact

 

+44 (0)20 7594 5825m.shaffer Website

 
 
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Assistant

 

Mr John Murrell +44 (0)20 7594 2845

 
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Location

 

M221Royal College of ScienceSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Zainol:2019:10.1016/j.compscitech.2018.11.017,
author = {Zainol, Abidin MS and Herceg, T and Greenhalgh, ES and Shaffer, M and Bismarck, A},
doi = {10.1016/j.compscitech.2018.11.017},
journal = {Composites Science and Technology},
pages = {85--92},
title = {Enhanced fracture toughness of hierarchical carbon nanotube reinforced carbon fibre epoxy composites with engineered matrix microstructure},
url = {http://dx.doi.org/10.1016/j.compscitech.2018.11.017},
volume = {170},
year = {2019}
}

RIS format (EndNote, RefMan)

TY  - JOUR
AB - Fibre reinforced hierarchical composites further reinforced with up to 25wt.% of carbon nanotubes (CNTs) were manufactured using a wet powder impregnation route. Microstructural heterogeneity in the matrix of these laminates was engineered during wet powder impregnation to produce CNTs rich regions with spatial separation. The Mode I fracture toughness of these heterogeneous hierarchical composites increased by 41% and 26% compared to that of baseline carbon fibre epoxy composites and hierarchical composites with homogeneously distributed CNTs throughout the matrix with similar CNT content, respectively. Increased crack path tortuosity was observed to contribute to this increase in fracture toughness. The interlaminar shear strength was unaffected by the matrix microstructural heterogeneity.
AU - Zainol,Abidin MS
AU - Herceg,T
AU - Greenhalgh,ES
AU - Shaffer,M
AU - Bismarck,A
DO - 10.1016/j.compscitech.2018.11.017
EP - 92
PY - 2019///
SN - 0266-3538
SP - 85
TI - Enhanced fracture toughness of hierarchical carbon nanotube reinforced carbon fibre epoxy composites with engineered matrix microstructure
T2 - Composites Science and Technology
UR - http://dx.doi.org/10.1016/j.compscitech.2018.11.017
UR - http://hdl.handle.net/10044/1/64349
VL - 170
ER -