Imperial College London
Portrait Picture

Professor Stepan Lucyszyn FREng FIEEE

Faculty of Engineering, Department of Electrical and Electronic Engineering

Professor of Millimetre-wave Systems
 
 
 
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Contact

 

+44 (0)20 7594 6167s.lucyszyn Website CV

 
 
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Assistant

 

Ms Susan Brace +44 (0)20 7594 6215

 
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Location

 

602Electrical EngineeringSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Shin:2022:10.1109/ACCESS.2022.3167437,
author = {Shin, S-H and Payapulli, R and Zhu, L and Stanley, M and Shang, X and Ridler, N and Lucyszyn, S},
doi = {10.1109/ACCESS.2022.3167437},
journal = {IEEE Access},
pages = {41708--41719},
title = {3-D Printed Plug and Play Prototyping for Low-cost Sub-THz Subsystems},
url = {http://dx.doi.org/10.1109/ACCESS.2022.3167437},
volume = {10},
year = {2022}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - Polymer-based additive manufacturing using 3-D printing for upper-millimeter-wave ( ca. 100 to 300 GHz) frequency applications is now emerging. Building on our previous work, with metal-pipe rectangular waveguides and free-space quasi-optical components, this paper brings the two media together at G-band (140 to 220 GHz), by demonstrating a compact multi-channel front-end subsystem. Here, the proof-of-concept demonstrator integrates eight different types of 3-D printed components (30 individual components in total). In addition, the housing for two test platforms and the subsystem are all 3-D printed as single pieces, to support plug and play development; offering effortless component assembly and alignment. We introduce bespoke free-space TRM calibration and measurement schemes with our quasi-optical test platforms. Equal power splitting plays a critical role in our multi-channel application. Here, we introduce a broadband 3-D printed quasi-optical beamsplitter for upper-millimeter-wave applications. Our quantitative and/or qualitative performance evaluations for individual components and the complete integrated subsystem, demonstrate the potential for using consumer-level desktop 3-D printing technologies at such high frequencies. This work opens-up new opportunities for low-cost, rapid prototyping and small-batch production of complete millimeter-wave front-end subsystems.
AU  - Shin,S-H
AU  - Payapulli,R
AU  - Zhu,L
AU  - Stanley,M
AU  - Shang,X
AU  - Ridler,N
AU  - Lucyszyn,S
DO  - 10.1109/ACCESS.2022.3167437
EP  - 41719
PY  - 2022///
SN  - 2169-3536
SP  - 41708
TI  - 3-D Printed Plug and Play Prototyping for Low-cost Sub-THz Subsystems
T2  - IEEE Access
UR  - http://dx.doi.org/10.1109/ACCESS.2022.3167437
UR  - https://ieeexplore.ieee.org/document/9757188
UR  - http://hdl.handle.net/10044/1/96521
VL  - 10
ER  -
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