Imperial College London
Alternate

ProfessorSilvestrePinho

Faculty of Engineering, Department of Aeronautics

Professor in the Mechanics of Composites
 
 
 
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Contact

 

+44 (0)20 7594 5076silvestre.pinho Website

 
 
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Location

 

314City and Guilds BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@article{Pascoe:2019:10.1016/j.compscitech.2019.107681,
author = {Pascoe, J-A and Pimenta, S and Pinho, ST},
doi = {10.1016/j.compscitech.2019.107681},
journal = {Composites Science and Technology},
title = {Interlocking thin-ply reinforcement concept for improved fracture toughness and damage tolerance},
url = {http://dx.doi.org/10.1016/j.compscitech.2019.107681},
volume = {181},
year = {2019}
}
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RIS format (EndNote, RefMan)

TY  - JOUR
AB  - An original concept for improving the delamination resistance and damage tolerance of a composite laminate is proposed. The concept is to insert interlocked thin-ply reinforcement units between the laminae. Each reinforcement unit consists of two thin-ply layers with tabs cut into one layer, and slits cut into the other layer. The slits, and the long axis of the tabs, are parallel to the fibre direction in their respective layers. The two thin-ply layers are placed together, and the tabs are inserted through the slits, creating an interlocked reinforcement unit.The effect of the reinforcement units was quantified via mode I (DCB) and mode II (4ENF) fracture toughness tests, as well as compression after impact tests. Mode I propagation fracture toughness was increased by 77.6%, while mode II fracture toughness was not affected. In the compression after impact tests, an 11.4% reduction in delamination area was achieved but this only resulted in a 5.1% increase in CAI strength.
AU  - Pascoe,J-A
AU  - Pimenta,S
AU  - Pinho,ST
DO  - 10.1016/j.compscitech.2019.107681
PY  - 2019///
SN  - 0266-3538
TI  - Interlocking thin-ply reinforcement concept for improved fracture toughness and damage tolerance
T2  - Composites Science and Technology
UR  - http://dx.doi.org/10.1016/j.compscitech.2019.107681
UR  - http://hdl.handle.net/10044/1/70981
VL  - 181
ER  -
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