Reactive Ion Etching (RIE) is a process whereby chemi-cal etching is accomplished through the bombardment of ions. This technique can be used for etching various ma-terials for top down fabrication of multi-layer thin films or functional devices such as metals, semiconductors, die-lectric materials or combinations. It also has the advantage of using multiple gases such as CF4, Argon, Oxygen and Nitrogen.

Sentech Etchlab 200 RIE System