The Combined Magnetron Sputtering and Electron Beam Deposition System is an ultra-high vacuum sputtering and evaporation system.

It consists of three sources for DC and RF magne-tron sputtering and four-pocket e-beam evaporator. It has two types substrate holders: one is with active cooling system; while the second is with a heating stage to 800°C and RF biasing option. Both substrate holders can handle wafers up to 4” in diameter.

The Combined Magnetron Sputtering and Electron Beam Deposition System
The Combined Magnetron Sputtering and Electron Beam Deposition System