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@article{Ollivier:2015:10.1080/09500839.2015.1121298,
author = {Ollivier, M and Harker, RM and Gourlay, CM},
doi = {10.1080/09500839.2015.1121298},
journal = {Philosophical Magazine Letters},
pages = {547--554},
title = {Etch pitting and subsurface pore growth during the thermal etching of silver},
url = {http://dx.doi.org/10.1080/09500839.2015.1121298},
volume = {95},
year = {2015}
}

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TY  - JOUR
AB  - The thermal etching of silver was extensively studied in the middle of twentieth century, revealing the key role of oxygen on surface morphology changes including: grains striation, grain-boundary grooving and etch pitting. Here we probe the role of the subsurface and defects induced by rolling on the thermal etching of pure silver sheet. Nanometre- and micrometre-sized faceted pores have been observed in the subsurface region after heat treatments in air. The relationship between these subsurface pores and rolling defects is demonstrated. A mechanism for the formation of subsurface pores based on the precipitation/reaction of dissolved oxygen is suggested which can also explain the aligned etch pitting observed.
AU  - Ollivier,M
AU  - Harker,RM
AU  - Gourlay,CM
DO  - 10.1080/09500839.2015.1121298
EP  - 554
PY  - 2015///
SN  - 0950-0839
SP  - 547
TI  - Etch pitting and subsurface pore growth during the thermal etching of silver
T2  - Philosophical Magazine Letters
UR  - http://dx.doi.org/10.1080/09500839.2015.1121298
UR  - http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000367141800005&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=1ba7043ffcc86c417c072aa74d649202
UR  - http://hdl.handle.net/10044/1/57344
VL  - 95
ER  -

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