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@inproceedings{Xian:2018:www.scientific.net/SSP.273.66,
author = {Xian, JW and Mohd, Salleh MAA and Zeng, G and Belyakov, SA and Yasuda, H and Nogita, K and Gourlay, CM},
doi = {www.scientific.net/SSP.273.66},
pages = {66--71},
title = {Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidification},
url = {http://dx.doi.org/10.4028/www.scientific.net/SSP.273.66},
year = {2018}
}

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TY  - CPAPER
AB  - Sn-0.7Cu-0.05Ni is a widely used Pb-free solder that solidifies into a near-eutectic microstructure and a small fraction of primary Cu6Sn5. This paper overviews in-situ time-resolved imaging experiments on the solidification of Sn-0.7Cu-0.05Ni solder under three conditions: (i) directional solidification, (ii) continuous cooling in a near-uniform thermal field, and (iii) solder joint solidification on a Cu substrate. Primary Cu6Sn5 grow as rods along [0001] in each case but can also grow as X-shaped crystals in (iii). There are significant differences in eutectic growth due to nucleation difficulties for tin in conditions (ii) and (iii).
AU  - Xian,JW
AU  - Mohd,Salleh MAA
AU  - Zeng,G
AU  - Belyakov,SA
AU  - Yasuda,H
AU  - Nogita,K
AU  - Gourlay,CM
DO  - www.scientific.net/SSP.273.66
EP  - 71
PY  - 2018///
SN  - 1012-0394
SP  - 66
TI  - Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidification
UR  - http://dx.doi.org/10.4028/www.scientific.net/SSP.273.66
ER  -

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