Imperial College London
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DrJunJiang

Faculty of Engineering, Department of Mechanical Engineering

Senior Lecturer
 
 
 
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Contact

 

jun.jiang

 
 
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Location

 

523City and Guilds BuildingSouth Kensington Campus

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Summary

 

Publications

Citation

BibTex format

@inproceedings{Wang:2024:10.1007/978-3-031-41341-4_23,
author = {Wang, Y and Liu, Y and Jiang, J},
doi = {10.1007/978-3-031-41341-4_23},
pages = {221--228},
title = {Temperature Effect in the Nickel-Superalloy Forming Process by Solid-State Bonding},
url = {http://dx.doi.org/10.1007/978-3-031-41341-4_23},
year = {2024}
}
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RIS format (EndNote, RefMan)

TY  - CPAPER
AB  - For those large-size components used in oil, chemical, aerospace, or nuclear industries, a novel solid-state additive manufacturing(AM) by piling up and bonding pre-shaped thick plate layers appears as a potential technology [1]. Apart from high efficiency and lower materials wastage, solid-state AM can avoid some solidification defects in traditional AM, like hot cracks and dendritic microstructure. The sound bonding between layers is achieved by hot-deformation method. The combination of high temperature and large plastic deformation would lead to severe microstructure evolution and break-up of the oxide films, which facilitates the full recovery of the joint performance to base level. For this new manufacturing method, the quality of the bonded interface and its dependence on the deformation condition would be the key focus. In this work, the effects of temperature on the bonding quality is investigated with IN718 samples using Gleeble. The tensile results of the bonded samples show comparable properties with the references.
AU  - Wang,Y
AU  - Liu,Y
AU  - Jiang,J
DO  - 10.1007/978-3-031-41341-4_23
EP  - 228
PY  - 2024///
SN  - 2195-4356
SP  - 221
TI  - Temperature Effect in the Nickel-Superalloy Forming Process by Solid-State Bonding
UR  - http://dx.doi.org/10.1007/978-3-031-41341-4_23
ER  -
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