In this section
@inproceedings{Hong:2021:10.1145/3411764.3445469,
author = {Hong, F and Myant, C and Boyle, D},
doi = {10.1145/3411764.3445469},
pages = {1--10},
title = {Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending},
url = {http://dx.doi.org/10.1145/3411764.3445469},
year = {2021}
}
TY - CPAPER
AB - Fabricating 3D printed electronics using desktop printers has become moreaccessible with recent developments in conductive thermoplastic filaments.Because of their high resistance and difficulties in printing traces invertical directions, most applications are restricted to capacitive sensing. Inthis paper, we introduce Thermoformed Circuit Board (TCB), a novel approachthat employs the thermoformability of the 3D printed plastics to constructvarious double-sided, rigid and highly conductive freeform circuit boards thatcan withstand high current applications through copper electroplating. Toillustrate the capability of the TCB, we showcase a range of examples withvarious shapes, electrical characteristics and interaction mechanisms. We alsodemonstrate a new design tool extension to an existing CAD environment thatallows users to parametrically draw the substrate and conductive trace, andexport 3D printable files. TCB is an inexpensive and highly accessiblefabrication technique intended to broaden HCI researcher participation.
AU - Hong,F
AU - Myant,C
AU - Boyle,D
DO - 10.1145/3411764.3445469
EP - 10
PY - 2021///
SP - 1
TI - Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending
UR - http://dx.doi.org/10.1145/3411764.3445469
UR - http://arxiv.org/abs/2011.06473v2
UR - https://dl.acm.org/doi/10.1145/3411764.3445469
ER -
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